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LED light fitting

A technology of LED lamps and LED light sources, which is applied in the direction of damage prevention measures for lighting devices, cooling/heating devices for lighting devices, lighting and heating equipment, etc., and can solve problems such as affecting service life, poor air circulation, and LED damage. Achieve large heat dissipation area, excellent heat dissipation effect, and good effect

Inactive Publication Date: 2009-02-25
NANKER GUANGZHOU SEMICON MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, high-power LEDs generate a lot of heat when they are working. If they are not dissipated in time, the LEDs will be damaged due to high temperature and affect their service life. Therefore, good heat dissipation is required.
like figure 1 As shown, the existing large-scale lamps generally use heat sinks to dissipate heat, but because the gaps between the heat sinks are arranged in parallel, if the wind blows from a direction perpendicular to the heat sinks, the air in the gaps between the heat sinks will not circulate. Smooth, that is, the flowing air outside has a bad effect on the forced heat dissipation of the lamps and lanterns

Method used

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  • LED light fitting
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Examples

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Embodiment Construction

[0022] Such as Figure 2 to Figure 7 As shown, the LED lamp of this embodiment includes a heat dissipation substrate 1, an LED light source assembly 2, a light-transmitting protective cover 3, a reflector 4, a drive assembly 7, and a power supply protection box 9. The LED light source assembly 2 includes several LEDs 21 and circuits The heat dissipation bottom plate 22, the LED light source assembly 2 is fixedly connected with the heat dissipation substrate 1 and conducts heat to the heat dissipation substrate 1 through the circuit heat dissipation bottom plate 22, the light-transmitting protective cover 3 and the heat dissipation substrate 1 576 heat dissipation rods 11 and two handle-shaped lamp installation parts 12 are arranged on the back of the heat dissipation substrate 1. The heat dissipation rods 11 are arranged in a matrix array of 24×24. The heat dissipation substrate 1 The thickness is 5mm, the diameter of the heat dissipation rod 11 is φ3mm, the height of the heat...

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Abstract

The invention discloses an LED lamp with excellent radiation effect, and comprises a radiation base (1), an LED light source module (2), and a light penetrating protection cover (3). The LED light source module (2) comprises a plurality of LEDs (21) and circuit radiation under plates (22); the LED light source module (2) is fixedly connected with the radiation base (1) transmits heat to the radiation base (1) through the circuit radiation under plates (22); the light penetrating protection cover (3) and the radiation base (1) are hermetically connected; and a plurality of array-distributed radiation rods are arranged on the back of the radiation base (1). The invention can be widely applied in the lamp field.

Description

technical field [0001] The invention relates to an LED lamp. Background technique [0002] As a new type of lighting source, LED is being more and more widely used in various occasions due to its outstanding advantages such as energy saving, environmental protection, high luminous efficiency, and long life. The application of high-power LED light sources in lamps can now be used as large lamps such as street lamps and wall washers. However, high-power LEDs generate a lot of heat when they are working. If they are not dissipated in time, the LEDs will be damaged due to high temperature and affect the service life. Therefore, good heat dissipation is required. Such as figure 1 As shown, the existing large-scale lamps generally use heat sinks to dissipate heat, but because the gaps between the heat sinks are arranged in parallel, if the wind blows from a direction perpendicular to the heat sinks, the air in the gaps between the heat sinks will not circulate. Smooth, that is,...

Claims

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Application Information

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IPC IPC(8): F21V29/00F21V15/02H01L23/367F21Y101/02F21V29/70F21Y115/10
CPCH01L2924/0002F21V29/2275F21V29/80
Inventor 吴俊纬
Owner NANKER GUANGZHOU SEMICON MFG
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