Structure, method and substrate for packaging touch-slide type thin type fingerprint identifier

Abstract

The invention relates to an encapsulation construct, an encapsulation method and an encapsulation basal plate of a contact slide type thin fingerprint identifier and mainly comprises a basal plate and a fingerprint identification wafer, wherein, the basal plate is provided with a contact slide area and a connection guiding part by definition and at least comprises a dielectric layer, a circuit layer and a protection layer. The circuit layer is provided with a plurality of external connection pads and at least one static connection guiding pad, which is a window adjacent to the dielectric layer, the protection layer is formed in the circuit layer, most of first openings of the protection layer are used for exposing the external connection pads and a second opening of the protection layer is used for exposing the static connection guiding pad and the window of the dielectric layer of the circuit layer, wherein, the static connection guiding pad and the window are in the contact slide area, the external connection pads are in the connection guiding part, the fingerprint identification wafer is electrically connected to the basal plate, and the second opening of the protection layer and the window of the dielectric layer expose a sensing area of the fingerprint identification wafer.

Description

technical field [0001] The invention relates to a packaging structure of a fingerprint recognizer, in particular to a packaging structure of a touch-slip type thin fingerprint recognizer. Background technique [0002] As shown in FIG. 1 , a conventional touch-and-slide fingerprint reader package structure 100 includes a substrate 110, a fingerprint recognition chip 120, an electrostatic discharge strip 130, at least one bonding wire 140 and a sealant 150. The fingerprint recognition chip 120 has an active surface 121, a back surface 122 and at least one welding pad 123. The back surface 122 of the fingerprint identification chip 120 is arranged on an upper surface 111 of the substrate 110, and a sensing area is formed on the active surface 121. 124, the welding pad 123 is located outside the sensing area 124, the electrostatic discharge strip 130 is protruded on the active surface 121 of the fingerprint recognition chip 120, and the electrostatic discharge strip 130 is locat...

AI Technical Summary

Problems solved by technology

[0002] As shown in FIG. 1 , a conventional touch-and-slide fingerprint reader package structure 100 includes a substrate 110, a fingerprint recognition chip 120, an electrostatic discharge strip 130, at least one bonding wire 140 and a sealant 150. The fingerprint recognition chip 120 has an active surface 121, a back surface 122 and at least one welding pad 123. The back surface 122 of the fingerprint identification chip 120 is arranged on an upper surface 111 of the substrate 110, and a sensing area is formed on the active surface 121. 124, the welding pad 123 is located outside the sensing area 124, the electrostatic discharge strip 130 is protruded on the active surface 121 of the fingerprint recognition chip 120, and the electrostatic discharge strip 130 is located between the sensing area 124 and Between the bonding pads 123 , the bonding wire 140 is electrically connected to a connection pad 112 of the substrate 110 and the bonding pad 123 of the fingerprint recognition chip 120 , and the encapsulant 150 is formed on the upper surface 111 of the substrate 110 and the active surface 121 of the fingerprint identification chip 120 to cover the bonding wire 140, and expose the sensing area 124 and the electrostatic discharge strip 130. The bar 130 is protruded on the active surface 121 of the fingerprint identification chip 120, so its manufacturing process is more complicated. In addition, since the fingerprint identification chip 120 is stacked on the substrate 110, and because the thickness of the substrate 110 is relatively thick, Therefore, the thickness of the package structure 100 of the touch-slide fingerprint reader cannot be reduced. Furthermore, when forming the encapsulant 150, it is necessary to prevent the encapsulant 150 from covering the ESD strip 130, and because the encapsulant 150 needs to cover the Welding wire 140, thus increasing the thickness of the conventional touch-swipe fingerprint reader package structure 100

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