Method for producing silicon single crystal
A production method and technology of silicon single crystal, applied in the direction of single crystal growth, single crystal growth, crystal growth, etc., can solve the problems of complex doping ratio, difficult to control product qualification rate, etc.
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Embodiment 1~5
[0033] Mix 20kg of N-type polysilicon, 30kg of P-type polysilicon raw materials with a resistivity of 2Ω·cm, and a P-type master alloy with a resistivity of 0.003Ω·cm.
[0034] A silicon single crystal with a target resistivity of 0.9 Ω·cm was produced by the Czochralski method. The detailed formulations of N-type polysilicon, P-type polysilicon and master alloy are shown in Table 1:
[0035] Table 1:
[0036]
[0037] Example 3
Embodiment 6~17
[0039] Mix 20kg of N-type polysilicon and 30kg of P-type polysilicon raw materials with a P-type master alloy with a resistivity of 0.003Ω·cm.
[0040] A silicon single crystal with a target resistivity of 0.9 Ω·cm was produced by the Czochralski method. The detailed formulations of N-type polysilicon, P-type polysilicon and master alloy are shown in Table 2:
[0041] Table 2:
[0042]
[0043]
Embodiment 18~24
[0045] Mix 10kg of N-type polysilicon, 40kg of P-type polysilicon raw material with a resistivity of 2Ω·cm, and a P-type master alloy with a resistivity of 0.003·cm.
[0046] A silicon single crystal with a target resistivity of 0.9 Ω·cm was produced by the Czochralski method. The detailed formulations of N-type polysilicon, P-type polysilicon and master alloy are shown in Table 3:
[0047] table 3:
[0048]
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