Wet etching apparatus and method

Abstract

The invention relates to a wet etching device which comprises a liquid supply device used for supplying an etchant, a transportation pipe communicated with the liquid supply device, as well as a liquid discharge pipe communicated with the transportation pipe and used for transporting the rest etchant, and a liquid discharge device used for receiving the rest etchant transported by the liquid discharge pipe and discharging the rest etchant. The invention also relates to a wet etching method which comprises the steps of providing the etchant, receiving the etchant to carry out wet etching to a wafer and discharging the rest etchant after finishing the wet etching. The wet etching device and the wet etching method solve the problem of the prior art that the rest etchant remains in the transportation pipe, therefore, the quality of wet etching is improved.

Description

technical field [0001] The invention relates to a wet etching process, in particular to a wet etching device and a corresponding wet etching method. Background technique [0002] With the development of semiconductor technology, the area of ​​semiconductor chips is getting smaller and smaller, and the line width in the chip is also shrinking. Therefore, the test of semiconductor technology capabilities is becoming more and more serious, and the control of process accuracy and process variation has become increasingly difficult. more important. In the process of manufacturing semiconductor chips, the more important is the etching process. In the process of manufacturing semiconductor chips, etching is used to define the size of functional devices in the chip and to manufacture through holes. Therefore, the quality of etching will directly affect the performance of the chip. [0003] Currently, there are two types of etching processes: wet etching and dry etching. Among th...

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Problems solved by technology

[0006] The present invention provides a wet etching device and method, which solves the problem that the transfer pipe in the wet etching device in the prior art has residual etching liquid after the wet etching is completed, and drops on the wafer surface to affect the quality of the wafer.

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