Optical device and manufacturing method thereof
A technology for optical equipment and optical components, which is used in semiconductor/solid-state device manufacturing, lasers, laser parts, etc., and can solve problems such as difficulty in controlling the dripping of liquid sealing resin, inability to achieve miniaturization, and reduction in yield.
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Embodiment approach 1
[0032] "Construction of Optical Devices"
[0033] figure 1 (a) shows the cross section of the optical device 1 (light receiving device) concerning Embodiment 1. FIG. in addition, figure 1 (b) is a plan view of the optical device 1 . The optical device 1 is formed by resin-sealing an optical element (light receiving element) 10 mounted on a wiring board 20 with a sealing resin 15 so that an optical function region (light receiving unit) 12 is exposed.
[0034] The optical element 10 as a semiconductor element has a rectangular flat plate shape, an optical function region 12 is formed in the central portion of one surface, and electrode pads are provided on the peripheral portion of the surface. The other surface of the optical element 10 on which the optical function region 12 is not formed is placed and fixed on the wiring board 20 . That is, the optical element 10 is mounted on the wiring board 20 with the optical function region 12 facing upward.
[0035]On the wiring b...
Embodiment approach 2
[0058] Figure 5 In the optical device 2 in the second embodiment shown in (a) and (b), there are three optical functional regions 14, 16, and 18 on the optical element 11, so the partial shape of the concave portion 30a is different from that in the first embodiment, but Since the wiring board 20 and the lead wires 24 are the same as those in the first embodiment, the following description will focus on the parts that are different from the first embodiment, and the description of the same parts will be omitted.
[0059] In the optical element 2 according to the present embodiment, three light receiving sections (optical functional regions 14 , 16 , 18 ) are arranged in parallel, and each of them serves a different function. In this embodiment, the center of the three light receiving parts is the main light receiving part. The light receiving parts at opposite ends have the function of confirming whether the main light receiving part receives light properly. That is, when a...
Embodiment approach 3
[0064] Image 6 The shown optical device 3 of the third embodiment differs from the first embodiment in the partial shape of the concave portion 30b, but since the wiring board 20 and the leads 24 are the same as those of the first embodiment, the differences from the first embodiment will be described below. , while omitting the description of the same part.
[0065]In the side surface 35b of the optical device 3 according to this embodiment, the second side surface 32 is the same as that of the first embodiment, but the first side surface 34b is different from that of the first embodiment. Unlike the first embodiment, the bottom-side dimple 42 formed by the first side surface 34b and the bottom surface 31b has a tapered shape with a large opening area on the bottom-side. The bottom pit 42 can be easily formed by using a negative resist as the resist 17 mounted on the optical function region 12 .
[0066] The manufacturing method of the optical device 3 according to this em...
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