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Optical device and manufacturing method thereof

A technology for optical equipment and optical components, which is used in semiconductor/solid-state device manufacturing, lasers, laser parts, etc., and can solve problems such as difficulty in controlling the dripping of liquid sealing resin, inability to achieve miniaturization, and reduction in yield.

Inactive Publication Date: 2009-04-01
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the manufacturing process of the optical functional element module described in Japanese Patent Laid-Open No. 2006-186288, it is difficult to control the dripping of the liquid sealing resin, and it is difficult to form the required shape in the required range. A large amount of sealing resin, when the liquid sealing resin is dropped between the optical functional element and the embankment, and when the package components are mounted on it, the liquid sealing resin may be stored on the optical functional part. Yield reduce
In order to effectively avoid such problems, it is necessary to increase the area of ​​the optical functional element, and fully ensure the distance between the end corresponding to the embankment of the optical functional element and the optical functional part. Miniaturization, one of the objectives of JP-A-2006-186288

Method used

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  • Optical device and manufacturing method thereof
  • Optical device and manufacturing method thereof
  • Optical device and manufacturing method thereof

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Experimental program
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Effect test

Embodiment approach 1

[0032] "Construction of Optical Devices"

[0033] figure 1 (a) shows the cross section of the optical device 1 (light receiving device) concerning Embodiment 1. FIG. in addition, figure 1 (b) is a plan view of the optical device 1 . The optical device 1 is formed by resin-sealing an optical element (light receiving element) 10 mounted on a wiring board 20 with a sealing resin 15 so that an optical function region (light receiving unit) 12 is exposed.

[0034] The optical element 10 as a semiconductor element has a rectangular flat plate shape, an optical function region 12 is formed in the central portion of one surface, and electrode pads are provided on the peripheral portion of the surface. The other surface of the optical element 10 on which the optical function region 12 is not formed is placed and fixed on the wiring board 20 . That is, the optical element 10 is mounted on the wiring board 20 with the optical function region 12 facing upward.

[0035]On the wiring b...

Embodiment approach 2

[0058] Figure 5 In the optical device 2 in the second embodiment shown in (a) and (b), there are three optical functional regions 14, 16, and 18 on the optical element 11, so the partial shape of the concave portion 30a is different from that in the first embodiment, but Since the wiring board 20 and the lead wires 24 are the same as those in the first embodiment, the following description will focus on the parts that are different from the first embodiment, and the description of the same parts will be omitted.

[0059] In the optical element 2 according to the present embodiment, three light receiving sections (optical functional regions 14 , 16 , 18 ) are arranged in parallel, and each of them serves a different function. In this embodiment, the center of the three light receiving parts is the main light receiving part. The light receiving parts at opposite ends have the function of confirming whether the main light receiving part receives light properly. That is, when a...

Embodiment approach 3

[0064] Image 6 The shown optical device 3 of the third embodiment differs from the first embodiment in the partial shape of the concave portion 30b, but since the wiring board 20 and the leads 24 are the same as those of the first embodiment, the differences from the first embodiment will be described below. , while omitting the description of the same part.

[0065]In the side surface 35b of the optical device 3 according to this embodiment, the second side surface 32 is the same as that of the first embodiment, but the first side surface 34b is different from that of the first embodiment. Unlike the first embodiment, the bottom-side dimple 42 formed by the first side surface 34b and the bottom surface 31b has a tapered shape with a large opening area on the bottom-side. The bottom pit 42 can be easily formed by using a negative resist as the resist 17 mounted on the optical function region 12 .

[0066] The manufacturing method of the optical device 3 according to this em...

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PUM

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Abstract

The invention provides a small optical apparatus with a bared optical function region, which can be made by a simple method in low cost. An optical element 10 mounted on a wiring board 20 is sealed by a sealing resin15 except an optical function region 12. Wires 24 connecting the wiring board 20 with the optical element 10 are also sealed by the sealing resin. The optical function region 12 is exposed as a bottom surface 31 of a recess 30 whose side surface 35 is formed by the sealing resin 15. The recess 30 has a two-level structure of a bottom recess and a portion located over the bottom recess 40. A stepped portion 36 extends from an upper end of a first side surface 34 of the bottom recess to a lower end of a second side surface 32 of the bottom recess 40.

Description

technical field [0001] The present invention relates to an optical device and a manufacturing method thereof, and more particularly to an optical device including an optical element and a wiring board on which the wiring board is mounted, and wherein an electrical connection portion between the optical element and the wiring board is sealed with a resin, and a manufacturing method thereof. Background technique [0002] Conventionally, an optical device in which an optical semiconductor element such as a solid-state imaging element or an LED is mounted on a wiring board has been provided with a hollow package structure in which a light-transmitting substrate is disposed above the optical function surface (for example, , see Japanese Patent Laid-Open No. 2003-332542) or a structure in which a transparent resin is coated on the optical function surface. [0003] However, in optical equipment with this structure, if it is intended to receive or emit short-wavelength blue-violet ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/31H01L23/488H01L21/50H01L21/56H01L27/146H01L27/148H01L33/00H01L31/0203H01S5/00H01L33/56H01L33/62
CPCH01L24/97H01L2224/92247H01L2924/1815H01L33/60H01L2224/97H01L2924/12041H01L2224/48227H01L33/486H01L2924/01029H01L27/14618H01L31/0203H01L2224/73265H01L2224/32225H01L24/73H01L2224/48091H01L2924/00014H01L2924/00H01L2924/00012
Inventor 南尾匡纪谷口正记石田裕之吉川则之
Owner PANASONIC CORP