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Method for producing printed circuit board for local region high frequency circuit by half-addition method

A technology for printed circuit boards and local areas, applied in the direction of circuit substrate materials, printed circuit manufacturing, printed circuits, etc., can solve the problems of low loss, high price, low dielectric, etc., and achieve the effect of reducing use and saving costs

Active Publication Date: 2009-04-01
DONGGUAN SHENGYI ELECTRONICS
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] When the local area of ​​the printed circuit board has high-frequency characteristics requirements, it will be realized by mixing the high-frequency material Rogers4350 and ordinary FR-4 board. Rogers4350 is a high-frequency board product of Rogers Company. It has low dielectric constant and low loss. , very suitable for very high frequency / broadband applications to minimize propagation loss, however, because Roger material is expensive, 8 to 10 times that of ordinary sheet materials, bringing great pressure to cost control

Method used

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  • Method for producing printed circuit board for local region high frequency circuit by half-addition method
  • Method for producing printed circuit board for local region high frequency circuit by half-addition method
  • Method for producing printed circuit board for local region high frequency circuit by half-addition method

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Embodiment Construction

[0017] The present invention will be described in detail below in conjunction with the accompanying drawings.

[0018] Such as figure 1 Shown, the semi-additive method of the present invention makes the method for the high-frequency circuit printed circuit board of local area, comprises the following steps:

[0019] Step 1: Embed the Rogers plate in the area that requires high-frequency characteristics on a common plate; Position, mill out the groove on the ordinary plate, and then mill out the shape of the Rogers plate corresponding to the groove and etch the copper foil on its surface, and then embed it in the groove; figure 2 As shown, the common plate 7 includes an L2 layer 71 and an L1 layer (not shown) and an L3 layer 73 disposed on both surfaces of the L2 layer 71. The L2 layer 71 is the base material, and the L1 layer (not shown) and the L3 layer 73 are Copper foil, etch the L1 layer (not shown), and mill out the groove 74 in the area where the high-frequency charac...

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Abstract

The present invention relates to a method for manufacturing a localized region high frequency circuit printed circuit board by a semi-additive method, including the following steps: embedding a Rogers sheet at regions of common sheet which has requirements to the high-frequency characteristics; mixing and pressing with additional common sheet; sanding well the seam crossing of the Rogers sheet and common sheet; and depositing copper and plating to generate a layer of level copper foil on the surface of the Rogers sheet and common sheet. The present invention adopts an embedded stitching method for pressing a high-frequency material Rogers into regions having high-frequency characteristic requirement, and then adopts a semi-additive method to plate a layer of copper on the shared surface of the Rogers and ordinary FR-4 for wire laying, for implementing effective connection of electric signals, thereby minimizing the use of Rogers material, and saving cost under the precondition of guaranteeing functions.

Description

technical field [0001] The invention relates to the field of printed circuit board manufacture, in particular to a method for manufacturing a local area high-frequency circuit printed circuit board by a semi-additive method. Background technique [0002] When the local area of ​​the printed circuit board has high-frequency characteristics requirements, it will be realized by mixing the high-frequency material Rogers4350 and ordinary FR-4 board. Rogers4350 is a high-frequency board product of Rogers Company. It has low dielectric constant and low loss. , very suitable for very high frequency / broadband applications to minimize propagation loss, however, because Roger material is expensive, 8 to 10 times that of ordinary sheet materials, bringing great pressure to cost control. Contents of the invention [0003] The purpose of the present invention is to provide a method of semi-additive method for manufacturing high-frequency circuit printed circuit boards in local areas. Th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K1/03
Inventor 高斌
Owner DONGGUAN SHENGYI ELECTRONICS
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