Silicon-aluminium alloy target material with high silicon content for sputtering and coating film, and method of producing the same

A silicon-aluminum alloy, sputtering coating technology, applied in sputtering coating, metal material coating process, ion implantation plating, etc., can solve the problem of difficult preparation of silicon-aluminum alloy target material with high silicon content, material density Low, can not be used as a target and other problems, to achieve the effect of small and uniform silicon phase size, high alloy purity, and low cost

Inactive Publication Date: 2009-04-08
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The infiltration method generally prepares materials with a Si content of 50% to 70%, and it is not suitable if the content is too high or too low. Moreover, because the method needs to prepare a porous skeleton in advance, the process is long and the cost is the highest. There are few changes in composition, which cannot meet the requirements of different compositions,

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  • Silicon-aluminium alloy target material with high silicon content for sputtering and coating film, and method of producing the same

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] For alloy targets with a composition of 70% Si-Al, the pre-press molding sintering process is adopted, and the mixed Si powder and Al powder with different particle sizes are used as raw materials. The particle size of Si powder is 50 μm, and the particle size of Al powder is 10 μm. The purity of the metal powder is 99.5%, and the oxygen content in the powder is 120ppm. After weighing the two powders according to the composition ratio of 70% Si and 30% aluminum by weight, mix them in a ball mill for 16 hours, and add Si-Al weight when mixing. 1% molding agent, the main component of the molding agent is stearic acid, put the mixed powder into the mold, and vibrate evenly; put the mold on a hydraulic press for compression molding, ensure that the pressing pressure is at 20MPa, and the silicon aluminum formed after pressing The alloy billet is fragile, so it should be carefully removed from the mold and placed in a ceramic sintering boat. Put the pressed silicon-aluminum al...

Embodiment 2

[0036] For the alloy target with 70% Si-Al composition, the direct hot pressing sintering process is adopted. Si powder and Al powder with different particle sizes are used as raw materials for hot pressing and sintering. The particle size of the Si powder is 10 μm, the particle size of the Al powder is 50 μm, the purity of the two metal powders is 99.5%, and the oxygen content in the powder is lower than 120 ppm. The two powders are weighed according to the composition ratio of 70% Si and 30% Al by weight. After measuring, mix in a ball mill for 1 hour, add a molding agent with 3% by weight of Si-Al during mixing, the main component of the molding agent is sodium stearate, put the mixed powder into a mold, and vibrate evenly. Put the mold filled with Si-Al powder on a heatable hot press, and the upper and lower pressure heads can heat the whole mold together with the internal metal powder through the current. First, pre-press the mold with a pressing force of 50MPa; then Hea...

Embodiment 3

[0038]For the alloy target with 95% Si-Al composition, the direct hot pressing sintering process is adopted. For the alloy target with 95% Si-Al composition, the direct hot pressing sintering process is adopted. Si powder and Al powder with different particle sizes are used as raw materials for hot pressing and sintering. The particle size of the Si powder is 50 μm, the particle size of the Al powder is 10 μm, the purity of the two metal powders is 99.5%, the oxygen content in the powder is 120 ppm, and the two powders are weighed according to the composition ratio of 95% Si and 5% Al by weight Finally, mix in a ball mill for 16 hours, add Si-Al weight 3% molding agent during mixing, the molding agent main component is stearic acid, put the mixed powder into the mold, and vibrate evenly. Place the mold filled with Si-Al powder on a heatable hot press, and the upper and lower pressing heads can heat the entire mold together with the internal metal powder through current. First...

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Abstract

The invention relates to a Si-Al alloy target with 25-95 percent of silicon used in vacuum sputtering coating, which adopts the processes of pre-press molding sintering and direct hot press molding. As the aluminum in the Si-Al alloy has low melting point, the silicon powder can be bonded together by the aluminum under high temperature sintering bonding, so as to obtain the required Si-Al alloy target stock of various components, and then the stock is mechanically processed to reach the required specification and size. The Si-Al alloy target of the invention has the advantages of adjustable Si-Al alloy target components, high alloy purification, fine and uniform silicon phrase in the alloy and high density of the Si-Al target. Moreover, the process of the invention with short process flow and lower cost can obtain the high-quality Si-Al alloy target, and the prepared Si-Al alloy target can be applied to both functional films and decorative films.

Description

technical field [0001] The invention relates to a silicon-aluminum alloy target material with high silicon content (25%-95% Si content) used for vacuum sputtering coating. Background technique [0002] Vacuum coating technology is an important surface processing technology that has been increasingly used in surface treatment and surface coating industries in recent years. Vacuum coating technology is used to physically sputter on the surface of various devices that require surface treatment. The components of the shooting target are transferred to the surface of the device to obtain various required film layers with different properties, which can realize the modification of the surface film layer or surface decoration. There are no "three wastes" in the entire process of vacuum surface coating, which becomes a kind of The green and environmentally friendly surface treatment process can be used to replace other surface treatment methods such as chemical plating and electropl...

Claims

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Application Information

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IPC IPC(8): C23C14/06C23C14/34B22F3/12
Inventor 余琨赵俊
Owner CENT SOUTH UNIV
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