Automatic testing and sorting machine for wafer

Abstract

The invention relates to a classifier for automatically testing wafers, which comprises a feeding box, a receiving box and an empty box arranged at the front end of a stand. The feeding box is used for placing wafers to be tested, the receiving box is used for placing the tested wafers with different levels, while the empty box can receive an empty charging tray at the feeding box or an empty charging tray needing to supplement the receiving box. In addition, a test device is arranged at the back end of the stand, and is provided with a tester and a probe capable of lifting; two transfer devices capable of moving between a transportation area and the test device transfer the wafers to be tested alternately to the test device to test, and transfer the wafers after being tested to the transportation area; and a pick-and-place device is used for picking the wafers to be tested on the feeding box and placing the wafers on the two transfer devices, and picking and placing the tested waferson the two transfer devices to the receiving boxes with different levels respectively according to the test result. Therefore, the classifier can ensure quality of the tested articles and effectivelypromote working convenience and usage benefit of productivity.

Description

technical field [0001] The invention relates to an automatic wafer testing and sorting machine that can automatically perform wafer testing and sorting operations, thereby effectively improving operation convenience and testing productivity. Background technique [0002] Generally, after the dicing operation of the chip is completed, in order to ensure the yield rate of the chip and avoid the cost waste of the subsequent packaging process, the chip test operation will be carried out before the packaging process is carried out to test whether the electrical properties of the chip are damaged; see figure 1 , the wafer testing device 10 is to set up a probe 11 on the frame, the probe 11 has a plurality of probes 111, and the plurality of probes 111 are located at the through holes of the frame, and the probes 11 and connect the tester 12 that is positioned at the rear, described tester 12 is in order to discriminate good product wafer or defective product wafer, is provided wi...

AI Technical Summary

Problems solved by technology

[0004] The described wafer testing device is all to be carried out in the mode of manual operation because the sorting operation after feeding and testing is carried out, so described device still can't reach the operation of automation on the sorting operation of front segment and rear segment, and must It can be effectively improved, and the tester is in a standby state after the material supply and the sorting operation after the test are completed, and the test operation must be completed after the material supply operation is completed. The long standby time will seriously affect the test production capacity, so Under the trend of emphasizing comprehensive automation and improving testing capacity, how to design an operation that can fully automate testing and classification to effectively improve testing capacity is the target of the industry's efforts in research and development.

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