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Heat radiating device of memory

A technology of a heat sink and a memory stick, which is applied in cooling/ventilation/heating transformation, instruments, electrical digital data processing, etc., can solve the problems of easy loss of fixed parts, cumbersome disassembly and assembly process, etc., and achieves convenient operation in the installation and disassembly process. Effect

Inactive Publication Date: 2009-04-22
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But the disassembly and assembly process of the above method is more cumbersome
At the same time, these small fixing parts are easy to lose during disassembly and assembly

Method used

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  • Heat radiating device of memory
  • Heat radiating device of memory
  • Heat radiating device of memory

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Experimental program
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Embodiment Construction

[0011] Referring to FIG. 1 , the memory stick cooling device of the present invention is used to dissipate heat from a memory stick 30 , which includes a first heat sink 10 and a second heat sink 20 . Two sides of the memory stick 30 are respectively provided with a plurality of memory chips 32 .

[0012] The first heat sink 10 is strip-shaped, with a recess (not numbered) on the inner side for accommodating the memory chip 32 on one side of the memory bar 30 , and a plurality of cooling fins 12 vertically on the outer side. One end of the first heat sink 10 defines a button hole 16 , and the other end of the first heat sink 10 defines a semi-cylindrical protruding portion 18 .

[0013] The second heat sink 20 has a structure similar to that of the first heat sink 10, and its inner surface is provided with a depression that can accommodate the memory chip 32 on the other side of the memory bar 30, and its outer surface is vertically provided with a plurality of cooling fins 22...

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PUM

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Abstract

The invention relates to a cooling device of a memory module for cooling the memory module which is provided with a plurality of memory chips on the two side surfaces. The cooling device comprises a first cooling part and a second cooling part for clamping the memory module, and the two ends of the first and the second cooling parts are respectively and correspondingly buckled and connected. The cooling device of the memory module is characterized by convenient installation and dismantlement.

Description

technical field [0001] The invention relates to a cooling device for a memory stick. Background technique [0002] With the rapid development of computer technology, the demand for memory increases, the storage capacity and frequency of memory sticks continue to increase, and the heat generated during the working process also increases accordingly. How to dissipate heat from memory sticks during use has become more and more important . A common method at present is to install a heat sink on the memory stick to dissipate heat. In the prior art, the cooling fins are usually tightly attached to the memory sticks by using fixing parts such as screws and tenons and matching corresponding openings on the memory sticks. But above-mentioned method dismounting process is more loaded down with trivial details. At the same time, these tiny fixing parts are easy to lose during disassembly and assembly. Contents of the invention [0003] In view of the above, it is necessary to pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20H05K7/20
CPCG06F1/20H01L23/4093H01L2924/0002H01L2924/00
Inventor 刘长春甘小林何友光
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD