Inner imbedded type multifunctional integration type structure for integration protection element and preparation method thereof

A protection component and multi-functional technology, applied in the field of embedded multi-functional integrated structure and its production, can solve the problems of single function, cost consumption, and occupying the volume of electronic products, so as to increase functionality, reduce number, and reduce volume Effect
CN101414602AInactive Publication Date: 2009-04-22INPAQ TECH
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
INPAQ TECH
Publication Date
2009-04-22
Estimated Expiration
Not applicable Β· inactive patent

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Abstract

The invention relates to a built-in multifunctional integrated structure of an integrated protection element and a fabrication method thereof. In the method, more than two passive elements are integrated on an element structure by a multi-layer circuit board design concept, the obtained finished product is adhered to a substrate in the manner of surface adhesion so as to be applied to an universal serial bus (USB) terminal, thus achieving the purpose of protecting an electronic device which uses the USB. Therefore, the built-in multifunctional integrated structure can have the functions of overcurrent protection, overvoltage protection and static electricity resistance at the same time. Consequently, the built-in multifunctional integrated structure can effectively integrate two or a plurality of passive elements to enhance the functionality of the passive elements, and further can effectively reduce the space occupied by the passive elements on a circuit board and reduce the number of soldered joints.
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Description

Technical field

[0001] The invention relates to a multifunctional integrated structure and a manufacturing method thereof, in particular to a built-in multifunctional integrated structure integrating protection elements and a manufacturing method thereof. Background technique

[0002] In the future, electronic products will move towards being light, thin, short and small, so that electronic products can become more miniaturized. Passive components occupy the largest area in electronic products. Therefore, the ability to effectively integrate passive components will enable electronic products to achieve light, thin, short, and small functions.

[0003] However, the design of existing passive components is mainly based on a single function. Therefore, when an electronic product needs to install passive components with different functions to protect the electronic product, the prior art can only install multiple passive components with a single function in the electronic product. Th...

Claims

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