Inner imbedded type multifunctional integration type structure for integration protection element and preparation method thereof

Abstract

The invention relates to a built-in multifunctional integrated structure of an integrated protection element and a fabrication method thereof. In the method, more than two passive elements are integrated on an element structure by a multi-layer circuit board design concept, the obtained finished product is adhered to a substrate in the manner of surface adhesion so as to be applied to an universal serial bus (USB) terminal, thus achieving the purpose of protecting an electronic device which uses the USB. Therefore, the built-in multifunctional integrated structure can have the functions of overcurrent protection, overvoltage protection and static electricity resistance at the same time. Consequently, the built-in multifunctional integrated structure can effectively integrate two or a plurality of passive elements to enhance the functionality of the passive elements, and further can effectively reduce the space occupied by the passive elements on a circuit board and reduce the number of soldered joints.

Description

Technical field [0001] The invention relates to a multifunctional integrated structure and a manufacturing method thereof, in particular to a built-in multifunctional integrated structure integrating protection elements and a manufacturing method thereof. Background technique [0002] In the future, electronic products will move towards being light, thin, short and small, so that electronic products can become more miniaturized. Passive components occupy the largest area in electronic products. Therefore, the ability to effectively integrate passive components will enable electronic products to achieve light, thin, short, and small functions. [0003] However, the design of existing passive components is mainly based on a single function. Therefore, when an electronic product needs to install passive components with different functions to protect the electronic product, the prior art can only install multiple passive components with a single function in the electronic product. Th...

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Problems solved by technology

[0003] However, the designs of existing passive components are all based on a single function

Therefore, when an electronic product needs to install passive components with different functions to protect the electronic product, the prior art can only install multiple passive components with a single function in the electronic product.

Therefore, the existing method not only consumes the cost of manufacturing, but also occupies the overall volume of the electronic product.

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