Workpiece storing and conveying device and cutting device having the workpiece storing and conveying device
A technology for conveying devices and workpieces, used in electrical components, conveyor objects, transportation and packaging, etc., can solve the problems of increasing lifting amount, large lifting amount, and conveying errors, preventing conveying errors, suppressing vibration and other problems. Noise, reliable closing effect
Active Publication Date: 2012-02-15
DISCO CORP
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Problems solved by technology
[0014] However, when the ring frame clamped by the clamper is tilted upward (especially when the wafer diameter is large, even if the tilt angle is small, the amount of tilt becomes large), in order to get over the step, The lifting amount needs to be increased, and the ring frame cannot go over the steps with only the pulling up amount of the clamp, resulting in a transfer error
Method used
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Embodiment Construction
[0031] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. refer to figure 1 , shows an external perspective view of a cutting device (cutting device) 2 to which the workpiece storing and conveying device of the present invention can be applied.
[0032] Cutting device 2 includes: figure 2 Shown is a first wafer storage section 4 as a first workpiece storage section, a second wafer storage section 6 as a second workpiece storage section, a first wafer transfer member 10, a second wafer transfer member 12, a wafer rail 14, a card Disk table 16 , cutting member 18 and cleaning member 20 .
[0033] The first wafer transport member 10 unloads the wafer from the first wafer storage unit 4 or the second wafer storage unit 6 , and transports the unloaded wafer to the chuck table 16 . Then, the wafer cleaned by the cleaning member 20 is loaded again into the first wafer storage unit 4 or the second wafer storage unit 6 .
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The present invention provides a workpiece storage and transfer device capable of reliably preventing workpieces such as semiconductor wafers from protruding from a workpiece storage portion for inspection, and a cutting device having the workpiece storage and transfer device. The workpiece storage and transfer device includes: a first workpiece storage unit for storing a plurality of workpieces; and a second workpiece storage unit disposed under the first workpiece storage unit. The second workpiece storage unit includes: a frame body, which has a first loading port opened on the side of the workpiece conveying member and a second loading port opened on the operator side; and a workpiece mounting table, which can be slid out from the second loading port . The workpiece mounting table is connected with the frame body by pulling out the sliding track, and the frame positioning pin which is forced upward is arranged at the bottom of the workpiece mounting table. When the workpiece mounting table is pulled into the predetermined position in the frame, the frame positioning pin and The guide block fixed on the bottom of the frame engages, so that the frame positioning pin is pulled down to a predetermined position.
Description
technical field [0001] The present invention relates to a workpiece storage and transfer device for storing workpieces such as semiconductor wafers, and a cutting device provided with the workpiece storage and transfer device. Background technique [0002] A large number of devices such as IC (Integrated Circuit: Integrated Circuit) and LSI (Large Scale Integration: Large Scale Integrated Circuit) are formed on the surface of a semiconductor wafer, and each device is divided by a predetermined dividing line (interval). The semiconductor wafer is processed to a predetermined thickness by grinding the back surface of the semiconductor wafer to a predetermined thickness, and then the planned dividing line is cut by a dicing device (cutting device). Therefore, it is divided into individual devices and used in electrical equipment such as mobile phones and personal computers. [0003] The cutting device includes: a cassette loading mechanism having a cassette loading table on wh...
Claims
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IPC IPC(8): H01L21/677H01L21/301H01L21/78
Inventor 奥鸣研悟野村优树
Owner DISCO CORP