Silicon microphone

A technology of silicon microphones and circuit boards, applied in the direction of electrostatic transducer microphones, semiconductor electrostatic transducers, etc., can solve the problems of increased cost, increased height of silicon microphone products, and difficult production, and achieve the effect of reduced manufacturing costs

Inactive Publication Date: 2009-05-06
GOERTEK INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the height requirements of such silicon microphone parts are further reduced for electronic products such as mobile phones, and the technology in patent CN200720022592.2 requires the superimposition of multi-layer circuit board substrates. The height of the microphone product increases. If the thickness of the base material is too small, it will be very difficult to manufacture, which will increase the cost

Method used

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Embodiment one: if figure 1 , figure 2 As shown, the silicon microphone includes a square metal shell 1; a square circuit board 2 whose size is consistent with the plane size of the metal shell and uses resin material as the base material; the square metal shell 1 and the circuit board 2 are bonded together to form a square cavity , become the environmental protection structure of the silicon microphone; the outside of the circuit board 2 is provided with a plurality of external electrodes 21, and the electrodes 21 are used to solder and install the silicon microphone on the main circuit board of the electronic product, and transmit the electrical signal of the silicon microphone; the circuit board 2 includes Double-layer circuit board substrates 23 and 24, wherein the second layer of circuit board substrate 23 on the inside is provided with an elongated large-area second hollow 231, and the second hollow 231 is used as a sound middle channel; The first layer of circu...

Embodiment 2

[0035] Embodiment two: if image 3 , Figure 4 shown, where Figure 4The dotted line indicates the position corresponding to the first acoustic hole 22 . Compared with the implementation case 1, this implementation case does not set the sound middle channel inside the circuit board, but sets the sound middle channel inside the sheet body 3 . The peripheral edge of the square piece 3 is provided with a bend towards one side of the circuit board 2, and the bent portion is bonded to the surface of the circuit board 2, so that a horizontal space 32 is formed between the sheet 3 and the surface of the circuit board 2 The vertical positions of the first sound hole 22 on the circuit board and the second sound hole 31 on the sheet body 3 do not correspond, and can communicate with each other through the horizontal space 32, so that the horizontal space 32 forms an elongated sound middle channel.

[0036] This implementation case can achieve an effect similar to that of the implemen...

Embodiment 3

[0038] Embodiment three: as Figure 8 , Figure 9 As shown, the first sound hole 22 on the circuit board 2 of the silicon microphone with this structure is a circular sound hole, and an annular sealing device 6 is arranged around the outside. This structure can make the Bottom-type silicon microphone installed on the main circuit board of electronic products, and the air tightness between the silicon microphone circuit board and the main circuit board of electronic products is good to prevent air leakage. A disc or a ring of glue.

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Abstract

The invention discloses a silicon microphone, including a casing, a circuit board, a first sound channel which includes a first sound hole provided on the circuit board, and a piece body fixed at the inner side of the circuit board and covering the first sound hole, wherein, a second sound hole is provided on the piece body, the first sound hole and the second sound hole are in mutual staggered arrangement, a sound middle passage is provided between the first sound hole and the second sound hole for communicating both of them, and the a silicon microphone chip is mounted on the piece body in a position corresponding to the second sound hole. This technology uses a piece body and a circuit board together to form a horizontal channel, to achieve the purpose of environmental protection, to avoid excessive application of the circuit board substrate layers, and to reduce manufacturing costs.

Description

technical field [0001] The invention relates to a silicon microphone, in particular to a silicon microphone structure which can well achieve the effect of environmental protection and is simple to manufacture. Background technique [0002] In recent years, as the volume of electronic products such as mobile phones and notebook computers has been continuously reduced and the performance requirements have become higher and higher, the volume of supporting electronic components has also been continuously reduced, and the performance and consistency have been improved. In this context, many new products have been launched in the field of microphone products as one of the important parts, among which silicon microphones realized in batches using semiconductor manufacturing and processing technology are the representative products. In order to meet the installation needs of electronic products, some products in silicon microphones need to have sound holes on the circuit board with...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/04
CPCH04R19/04H04R19/005
Inventor 宋青林庞胜利谷芳辉宋锐锋
Owner GOERTEK INC
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