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Manufacturing method of hollowed-out flexible circuit board

A technology for flexible circuit boards and manufacturing methods, applied to circuit substrate materials, removal of conductive materials by chemical/electrolytic methods, printed circuit components, etc., can solve the problem that the first base film does not have a first opening, etc.

Inactive Publication Date: 2011-03-23
AVARY HLDG (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, when using the flexible copper clad laminate (Flexible Copper Clad Laminate, FCCL) provided by the raw material manufacturer to produce the hollow flexible circuit board, because the copper foil and the first base film have been pressed in advance, the first base film does not have the first opening , therefore, the hollow flexible circuit board cannot be produced by the above method

Method used

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  • Manufacturing method of hollowed-out flexible circuit board
  • Manufacturing method of hollowed-out flexible circuit board
  • Manufacturing method of hollowed-out flexible circuit board

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Embodiment Construction

[0024] The manufacturing method of the hollowed-out flexible circuit board provided by the technical solution will be further described in detail below with reference to the drawings and embodiments.

[0025] see figure 1 , the manufacturing method of the hollowed-out flexible circuit board of the present technical solution comprises the following steps:

[0026] Step 1, see figure 2 , a flexible substrate 10 is provided, and the flexible substrate 10 includes a conductive layer 11 and an insulating layer 12 located on one side of the conductive layer 11 .

[0027] The conductive layer 11 is used to form a conductive pattern to realize signal transmission and processing. The most commonly used material for the conductive layer 11 is copper and copper alloys, but it can also be aluminum, aluminum alloys, silver, silver alloys or other conductive materials.

[0028] The insulating layer 12 is used to support the conductive layer 11 and is made of flexible material. The mos...

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Abstract

The present invention provides a method for manufacturing pierced flexible circuit board, wherein the method comprises the following procedures: providing a flexible substrate which comprises a conducting layer and an insulating layer on one side of the conducting layer; etching for forming a first opening on a preset area of the insulating layer; and preparing the conducting layer to a conducting pattern and pasting a covering layer on the other side of the conducting layer thereby exposing partial conducting pattern from the first opening and forming the pierced flexible circuit board. The manufacturing method of the technical plan according to the invention can use flexible copper-covering plate as raw material. Not only a higher precision is provided, but also a lower cost is required.

Description

technical field [0001] The invention relates to a method for manufacturing a circuit board, in particular to a method for manufacturing a hollowed-out flexible circuit board. Background technique [0002] With the wide application of flexible materials such as polyimide films in the electronic industry (see Sugimoto, E. "Applications of polyimidefilms to the electrical and electronic industries in 1989" published in IEEE Electrical Insulation Magazine, Volume 5, No. 1 Japan"), Flexible Printed Circuit Board (FPCB) is widely used in consumer electronics such as notebook computers, liquid crystal displays, digital cameras, and mobile phones due to its advantages of bendability, light weight, small footprint, and three-dimensional wiring. The product has a very wide range of applications. [0003] Hollow flexible circuit board, also known as embossed flexible circuit board. Such as Figure 14 As shown, the hollowed-out flexible circuit board 1 has a hollowed-out area 2 , and ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/06H05K1/03
Inventor 叶佐鸿黄晓君陈嘉成
Owner AVARY HLDG (SHENZHEN) CO LTD