Unlock instant, AI-driven research and patent intelligence for your innovation.

Methods and process of tapering waveguides and of forming optimized waveguide structures

A technology of waveguides and optical waveguides, which can be applied in the directions of optical waveguides, light guides, and light guides, and can solve complex problems.

Active Publication Date: 2009-05-20
COLOR CHIP ISRAEL
View PDF6 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0026] Prior art methods and processes for tapering waveguides and forming optimal waveguide structures do so in a relatively complex manner

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Methods and process of tapering waveguides and of forming optimized waveguide structures
  • Methods and process of tapering waveguides and of forming optimized waveguide structures
  • Methods and process of tapering waveguides and of forming optimized waveguide structures

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0041] In the following detailed description, numerous specific details are given in order to provide a thorough understanding of the present invention. It will be understood, however, to those skilled in the art that the present invention may be practiced without these specific details. In other instances, well-known methods, procedures, components and devices have not been described in detail so as not to obscure the present invention.

[0042] It should be understood that the present invention may be used in a variety of applications. Although the scope of the present invention is not limited in this respect, the devices and methods disclosed herein may be used in a variety of devices, such as optoelectronic devices, laser diodes, optical diodes, optical fibers, and the like. Matching devices between laser diodes and single-mode fibers, matching devices between single-mode and multi-mode fibers, focusing large optical points to small optical points, etc. Unless otherwise ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

In some embodiments of the present invention, an electrical field is applied across a waveguide substrate so as to induce ion exchange process that affects the cross section of the waveguide. Shaped electrical field may, according to the invention, may control the size and shape of the waveguide along it.

Description

Background technique [0001] Recently, with the use of wavelength division multiplexing (WDM) optical communication systems, the demand for optical devices used in WDM optical communication systems has remarkably increased. Optical fibers are generally used as a transmission path for optical signals in optical communications. However, there are technical limitations in fabricating optical fiber devices with multiple channels, such as multi-channel optical couplers and WDM devices. Therefore, a planar optical waveguide circuit (PLC) in which an optical waveguide and many unit optical devices are integrated is used in a WDM device. [0002] Optical communication systems are configured to propagate signals between multiple locations. With at least a portion of such a communication system, the signal is provided as light propagating along an optical pathway. At various locations along the optical pathway of a communication system, it may be necessary to shape or measure the patt...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): A61B5/00A61B5/02A61B5/04A61B5/08
CPCG02B6/12007G02B6/125C03C21/005G02B6/13C03B37/075
Inventor Y·马利诺维奇E·阿拉德A·希米E·波拉特R·格林贝格
Owner COLOR CHIP ISRAEL