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Low shrinkage epoxy-cationic curable compositions

A technology of cationic compound and epoxy composition, applied in the field of low-shrinkage epoxy cationic curable composition

Inactive Publication Date: 2009-06-03
HENKEL KGAA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] Despite the state of the art in the art, there is still a need for effective shrinkage inhibition in cationically cured epoxy compositions.

Method used

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  • Low shrinkage epoxy-cationic curable compositions
  • Low shrinkage epoxy-cationic curable compositions
  • Low shrinkage epoxy-cationic curable compositions

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-1

[0138] Preparation of Curable Formulations

[0139] Bis F-DGE (8.00 g, 25.6 mmol, amount of epoxy groups = 51.2 mmol), DBOX (2.52 g, 12.0 mmol) and tetraphenylethylene glycol (25 mg) were mixed at 110° C. and removed under vacuum. gas to obtain a homogeneous mixture. After cooling to room temperature, HD7980 (diaryliodonium hexafluorophosphate, 50 mg) was added to the mixture to give the corresponding curable formulation A as a homogeneous liquid.

[0140]

[0141] Curing Reaction and Shrinkage Test

[0142] About 5 g of mixture A obtained was used to measure its volume by gas-pychnometer. From the weight and volume of the sample, calculate its uncured density (=D 固化前 ). Three independent samples were used for the test, and each sample was tested 5 times to calculate the average density (D 固化前 ). Calculated D 固化前 It is 1.216. Then, the mixture was transferred into a silicone rubber mold and cured at 110°C for 2 hours, followed by post-curing at 140°C for 1 hour to o...

Embodiment 1-1-a

[0147] Preparation of Curable Formulations

[0148] Powdered DBOX (2.00 g, 9.51 mmol) was dispersed in Bis F-DGE (8.00 g, 25.6 mmol, amount of epoxy groups = 51.2 mmol). Tetraphenylethylene glycol (25 mg) and HD7980 (diaryliodonium hexafluorophosphate, 50 mg) were added to the resulting DBOX / BisF-DGE dispersion to obtain a heterogeneous preparation, which was used in Cured under the same conditions as Example 1-1.

[0149]

[0150] Curing reaction and shrinkage test were performed in the same manner as in Example 1-1.

[0151] As shown in Table 1, there is no difference in the degree of shrinkage between Example 1-1-a and Example 1-1, which shows that the addition of powdered DBOX that is not dissolved in the epoxy resin is equally effective in inhibiting their volume shrinkage.

Embodiment 1-1-b

[0153] Preparation of Curable Formulations

[0154] Powdered DBOX (2.00 g, 9.51 mmol) and silica filler FL1966 (10.0 g) were dispersed in F-DGE (8.00 g, 25.6 mmol, amount of epoxy groups = 51.2 mmol), tetraphenylethylene glycol (25 mg ) and HD7980 (diaryliodonium hexafluorophosphate, 50mg) in a mixture. The resulting heterogeneous formulation was cured under the same conditions as used in Example 1-1.

[0155]

[0156] Curing reaction and shrinkage test were performed in the same manner as in Example 1-1.

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Abstract

The present invention relates to compositions comprising an epoxy resin; a reagent selected from the group of cationic compounds or compounds which are capable to form cationic compounds or mixtures of those; at least one compound with two aromatic rings and at least one central cyclic oxygen bridged ring and the use of such compositions in adhesives, sealants and coatings.

Description

technical field [0001] The present invention relates to a composition comprising: an epoxy resin; a reactant selected from cationic compounds or compounds capable of forming cationic compounds or mixtures thereof; at least one compound having two aromatic rings and at least one Central cyclic oxygen-bridged rings; and to the use of these compositions for reducing shrinkage. Background technique [0002] Curable compositions comprising epoxides and cationic initiators (Bronsted acids, Lewis acids and their derivatives involving various latent initiators) are widely used in adhesives, sealants and coatings. Additionally, these compositions are considered most promising for electronic die attach and underfill. [0003] However, these compositions undergo shrinkage in their volume during the curing reaction. Volume shrinkage during the curing reaction causes voids and microcracks to form within the cured material and thus leads to a reduction in the mechanical strength of the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/40C08G59/68
CPCC08G59/42C08G59/68C08L63/00C08G59/40C08K5/151
Inventor 须藤淳远藤健铃木茜
Owner HENKEL KGAA
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