Thermal resistor, semiconductor device using the same, and electric device
A technology for semiconductors and electrical devices, applied in the field of thermal impedance bodies, can solve the problems of weak heat resistance of capacitors, limitation of working temperature and heat resistance of components, etc., and achieve the effects of improved reliability and low cost
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Embodiment 2
[0093] Next, in conjunction with an embodiment using the thermal resistor shown in FIG. 7 , a structure in which the function of a pushing member is added to the thermal resistors 8 - 1 and 8 - 2 in the semiconductor device shown in FIG. 1 will be discussed. When the thickness of the metal plate 16 is increased to 1 mm, and rotated and alternately stacked in the same manner, in the case of a thickness of 1 mm, even if pressure is applied, the metal plate 16 undergoes plastic deformation and does not become flat as in FIG. Resistors 8-1 and 8-2 function as leaf springs. That is, each metal plate 16 is in the state shown in FIG. 7 and is in the shape of a relatively thick leaf spring having creases. Therefore, the laminated body with the metal plates 16 stacked thereon has elasticity in the stacking direction as a whole.
[0094] As an example for explaining the effect of the invention, using the same model as in FIG. 6, the folded metal plates 16 with a thickness of 1 mm are al...
Embodiment 3
[0121] In the embodiment of the present invention shown in FIG. 8 , the thermal resistor is copper, so the thermal resistor itself is used as an electrode that is a good conductor of electricity and has a higher thermal resistance than a single metal. Here, the interposer 6 , the thermal resistor 8 - 1 , the electrode 3 - 2 , and the contact member 7 are sequentially stacked on the semiconductor element 4 to form a laminate, and the laminate is covered with the case cover 5 . In addition, a thermal resistor 8 - 3 , an electrode 3 - 1 , and a push member 7 are sequentially laminated on the copper pattern on the insulating substrate 2 to form a laminate, and the laminate is covered with the case cover 5 . The electrodes 3-1 and 3-2 are connected to electrode terminals (not shown) of capacitors and gate drivers outside the semiconductor device. Also, the same thermal resistor 8 - 1 is inserted between the semiconductor element 4 and the electrode 3 - 1 on the heat dissipation sub...
Embodiment 4
[0123] Of course, the same effect can be obtained by inserting a thermal resistor between the electrode and an electrical device such as a capacitor or a gate driver, and the electrode connects the thermal resistor having the above-mentioned conductivity to the heating element in the semiconductor device. In this case, by mounting the conductive thermal resistor outside the semiconductor device, the reliability of the electrical device as a whole can be improved and the cost can be reduced. In addition, the thermal resistor can be inserted between the conductors connecting the electrodes of the semiconductor device and the electric device, between the conductor and the electric device, or divided into multiple conductors and inserted between them.
[0124] FIG. 9 is an example of the case where the conductor is divided into a plurality and the thermal resistor 8-4 of the present invention is inserted therebetween. The electrode 3-2 of the semiconductor module 103 is connected ...
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Abstract
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