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Stacked IC encapsulation with interconnected top and bottom

A stacking, top-bottom technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problem of increasing the size of IC packages

Inactive Publication Date: 2009-06-24
KONINKLIJKE PHILIPS ELECTRONICS NV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the two existing methods, the disadvantage is that an extra substrate layer is used as a carrier, which increases the size of the IC package

Method used

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  • Stacked IC encapsulation with interconnected top and bottom
  • Stacked IC encapsulation with interconnected top and bottom
  • Stacked IC encapsulation with interconnected top and bottom

Examples

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Embodiment Construction

[0019] The following description of the invention can be read to enable those skilled in the art to practice it and is provided based on specific applications and conditions. Various modifications to the disclosed embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other embodiments and applications without departing from the spirit and scope of the invention. Thus, the present invention is not limited to the disclosed embodiments, but is to be accorded the widest scope consistent with the principles and features disclosed herein.

[0020] refer to figure 1 , shows a brief flowchart of a method for assembling a stackable IC package with top and bottom interconnects according to an embodiment of the present invention. In step 10, a die is provided having first and second relative longitudinal sides, first and second relative lateral sides, first and second major surfaces, and multiple dies arranged on th...

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Abstract

Consistent with an example embodiment, there is a stackable IC package (218) that comprises a die (206) having a first major surface and a second major surface (212). The first and second major (212) surfaces are joined by opposed pairs of longitudinal (208) and lateral sides (210). A conductive pattern (202) is electrically coupled to the first major surface of the die. The conductive pattern (202) extends past the longitudinal sides of the die and is folded back (204) in a direction (214) generally toward the die. The conductive pattern defines a first portion approximately co-planar with the first major surface of the die and a second portion approximately co-planar with the second major surface of the die. The first and second portions are electrically connectable to another stackable IC package. A support material (216) fixedly supports the conductive pattern (202) relative to the die (206) and supports the first and second portions of the conductive pattern is a spaced, generally parallel relationship to one another.

Description

technical field [0001] The present invention relates generally to stackable IC packages, and more particularly to stackable IC packages with top and bottom interconnects. Background technique [0002] Miniaturization and "system-in-package" in IC packaging are the driving forces for packaging solutions with stackable packages. Stackable packaging consists of two or more IC packages interconnected in a single device, effectively reducing volume, by "chip stacking" through a single package such as a packaged IC. The "footprint" typically used in devices can be mounted on a printed circuit board. [0003] In addition to being formed into a stack, IC packages must be electrically interconnected with each other in a predetermined manner. One current solution is the "Match-X" method from the Fraunhofer Institute in Germany. The Match-X concept consists of a stack of substrates containing electronics, on which interconnects between different substrates are achieved using solder ...

Claims

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Application Information

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IPC IPC(8): H01L25/10H01L23/31H01L23/498
CPCH01L23/4985H01L2225/1064H01L2225/1035H01L25/105H01L23/3114H01L2924/0002
Inventor J·W·维坎普
Owner KONINKLIJKE PHILIPS ELECTRONICS NV
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