Receding aperture plate in cooling module of reflow welding stove

A cooling module and reflow furnace technology, applied in welding equipment, auxiliary devices, metal processing equipment, etc., can solve the problems of increasing maintenance time and work difficulty, affecting the production efficiency and output of customers, and meeting the cooling efficiency and Temperature process curve requirements, improve operating time and production efficiency, save the effect of cleaning and maintenance

Active Publication Date: 2009-07-01
上海朗仕电子设备有限公司
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

But this increases the maintenance time and work difficulty, which i

Method used

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  • Receding aperture plate in cooling module of reflow welding stove
  • Receding aperture plate in cooling module of reflow welding stove

Examples

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Embodiment Construction

[0009] see figure 1 , figure 2 , the reflow orifice in the cooling module of the reflow oven of the present invention includes a reflow orifice body 1, a heat preservation plate 2, a plurality of Teflon air ducts 3, a temperature sensor 4, an electric heating wire 5 and ceramic terminals 6. A plurality of through holes 11, 21 for installing air guide pipes are correspondingly provided on the return orifice body 1 and the heat preservation plate 2, and a plurality of air guide pipes 3 are connected to the return orifice body 1 and the heat preservation plate 2, and the temperature sensor 4 And the electric heating wire 5 is respectively installed on the reflow orifice body and arranged between the reflow orifice body and the heat preservation plate, and the ceramic terminal 6 is installed on the upper surface of the heat preservation plate and is electrically connected with the temperature sensor. The return orifice body 1 and the heat preservation plate 2 are connected and f...

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Abstract

The invention relates to a reflux orifice plate in a reflow furnace cooling module, which comprises a reflux orifice plate body, a heat-preserving board, a plurality of air conducting pipes, a temperature sensor, an electric heating wire and a ceramic terminal. The reflux orifice plate body and the heat-preserving board are correspondingly provided with a plurality of through holes used for mounting the air conducting pipes; the air conducting pipes are connected to the refux orifice plate body and the heat-preserving board; the temperature sensor and the electric heating wire are arranged on the reflux orifice plate body respectively and arranged between the reflux orifice plate body and the heat-preserving board; and the ceramic terminal is arranged on the upper surface of the heat-preserving board and electrically connected with the temperature sensor. The reflux orifice plate can ensure that the surface temperature (about 150 DEG C) is slightly higher than the gasifying temperature of a soldering flux all the time, achieve the aim that the soldering flux is not adhered to or piled on the surface of the reflux orifice plate, and keep the cleanliness and free maintenance of the surface of the reflux orifice plate all the time. The reflux orifice plate can not influence the temperature of reflux cooling air completely under the condition that the heating wire works, and can meet the requirements of the cooling efficiency of a printed circuit board and a process temperature curve.

Description

technical field [0001] The invention relates to a reflow soldering furnace for brazing a circuit board carrying electronic components, in particular to a reflow orifice in a cooling module of the reflow soldering furnace. Background technique [0002] Reflow Oven (Reflow Oven) is a device used to solder circuit boards carrying electronic components. It provides a heating environment to heat and melt the solder paste so that surface mount components and circuit boards are reliably bonded together through the solder paste alloy. The solder paste used for brazing is made of fat-like flux and powder solder into a paste, which is applied to the soldering parts of the components of the circuit board by printing, and the electronic components are precisely mounted on it, and the reflow oven is used to Heat and melt to achieve reliable brazing of components. [0003] The flux in solder paste is usually a mixture of rosin as the main component, which is an auxiliary material to ens...

Claims

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Application Information

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IPC IPC(8): B23K1/008B23K3/08
Inventor 大卫海乐初剑英卢明
Owner 上海朗仕电子设备有限公司
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