Mask blank manufacturing method and coater

Abstract

The present invention provides a method for manufacturing mask blank and a coating device. The method comprises a step of contacting the slushing compound which obtains the front opening of nozzle from the liquid bath (20) that stores the liquid slushing compound through a nozzle (22) with a coated surface which is provided with a substrate used for forming the film of transfer pattern for forming the slushing compound film through relatively moving the substrate and nozzle and coating the slushing compound on the coated surface. In the forming step of slushing compound film, the slushing compound is supplied into the liquid bath (20) and simultaneously the control is executed for keeping the liquid level of the slushing compound in the liquid bath to a certain height in the process of coating the slushing compound to the coated surface.

Description

Technical field [0001] The present invention relates to a coating device and a method for manufacturing a mask blank for coating a coating liquid on a coated surface of a substrate using capillary phenomenon. Background technique [0002] In the prior art, when a photolithography method is used to form a pattern, it is necessary to coat a coating liquid such as a photoresist on a substrate to form a resist film, but it is known as a coating apparatus for applying the coating liquid (Coater), that is, spin coater. After the spin coater drops the coating liquid on the center of the substrate (the surface to be coated) that is held horizontally, the substrate is rotated at a high speed in the horizontal plane to spread the coating liquid over the entire substrate surface by the action of centrifugal force. A coating film is formed on the surface of the substrate. [0003] However, in this spin coater, there is a problem that resist bumps called "fringe" are generated in the peripher...

AI Technical Summary

Problems solved by technology

[0006] However, in the case of a large substrate, the amount of coating liquid consumed at one time is large, so the film thickness during coating tends to decrease

In particular, when the film thickness drop during coating is large, the inclination of the coating film thickness in the substrate surface becomes large, and the variation of the resist film thickness occurs in the substrate surface

As the size of the substrate increases, the variation in the resist film thickness in the substrate surface increases, and the in-plane unevenness of the resist film thickness becomes remarkable.

When the resist film thickness varies within the substrate surface, in-plane variation of CD occurs when forming a pattern

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