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Light source module and manufacturing process thereof

A technology of a light source module and a manufacturing method, which is applied to the manufacturing of light sources, point light sources, semiconductor/solid-state devices, etc., can solve the problems of poor heat dissipation performance of the LED light source module 100, achieve stable optoelectronic characteristics, improve work efficiency, and improve The effect of cooling efficiency

Inactive Publication Date: 2009-07-08
FOXSEMICON INTEGRATED TECHNOLOGY (SHANGHAI) INC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the heat dissipation performance of the LED light source module 100 prepared by this method is relatively poor.

Method used

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  • Light source module and manufacturing process thereof
  • Light source module and manufacturing process thereof
  • Light source module and manufacturing process thereof

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Experimental program
Comparison scheme
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Embodiment Construction

[0018] The embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0019] See figure 2 , the light source module 20 provided by the first embodiment of the present invention includes: a light emitting module 21 and a thermoelectric cooler (Thermo-electric Cooler, TEC for short) 22 .

[0020] The light emitting module 21 includes a first substrate 212, a metal circuit layer 214 disposed on the first substrate 212, a plurality of light emitting diodes disposed on the first substrate 212 and electrically connected to the metal circuit layer 214 respectively. chip 216, and a plurality of packages 218 respectively covering the LED chip 216. In this embodiment, the plurality of LED chips 216 are epitaxially grown on the first substrate 212 and electrically connected to the metal circuit layer 214 through gold wires 219 .

[0021] The first substrate 212 is a sapphire substrate, which has good insulation and t...

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Abstract

The invention relates to a light source module and a manufacturing method thereof. The light source module comprises a light-emitting module and a thermoelectric cooling module. The light-emitting module comprises a first insulating substrate and a plurality of light-emitting diode chips arranged on the first insulating substrate; the thermoelectric cooling module is formed on one side of the first insulating substrate opposite to the light-emitting diode chips, and comprises a second insulating substrate and a thermoelectric cooling unit group, the second insulating substrate is oppositely arranged to the first oppositely, the thermoelectric cooling unit group is arranged between the first insulating substrate and the second insulating substrate and connected with the first insulating substrate and the second insulating substrate in a hotlink manner, and the thermoelectric cooling unit group comprises a plurality of thermoelectric cooling units which are connected with each other.

Description

technical field [0001] The invention relates to a light source module and its manufacturing method, in particular to a light source module with good heat dissipation performance and its manufacturing method. Background technique [0002] A light-emitting diode (Light Emitting Diode, LED) is a solid-state optical component whose electrical and optical characteristics and lifetime are sensitive to temperature. Here, a new type of light-emitting diode that can maintain a stable light intensity during temperature changes can be found in Yukio Tanaka et al. A Novel Temperature-StableLight Emitting Diode in the document IEEE Transactions On Electron Devices, Vol.41, No.7, July1994. Generally speaking, higher temperature will lead to lower internal quantum effects and significantly shorten the lifetime; on the other hand, the resistance of semiconductors decreases with the increase of temperature, and the sliding resistance will bring larger current and more More heat is generated...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/00H01L25/075H01L23/38H01L21/50F21V29/00
CPCF21K9/00F21V29/407F21Y2101/02F21V29/54F21Y2115/10H01L2224/16225H01L2224/48091H01L2224/48227H01L2924/00014
Inventor 江文章
Owner FOXSEMICON INTEGRATED TECHNOLOGY (SHANGHAI) INC