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Anisotropic conductive adhesive compositions

An adhesive and composition technology, applied in conductive adhesives, thermoplastic polymer dielectrics, adhesives, etc., can solve problems such as lack of strong adhesion in flexible circuits

Inactive Publication Date: 2009-07-22
3M INNOVATIVE PROPERTIES CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

A major disadvantage of these systems is the lack of strong adhesion to many kinds of flex circuits

Method used

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  • Anisotropic conductive adhesive compositions

Examples

Experimental program
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Effect test

example

[0047] In the following test methods and examples, sample dimensions are approximate. Materials can be purchased from chemical suppliers such as Aldrich, Milwaukee, WI, Sigma-Aldrich, St. Louis, MO, or the following indicated supplier. All material percentages below are reported as weight percent.

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Abstract

Provided are adhesive compositions comprising a mixture of a maleimide terminated polyimide resin, a thermoplastic resin compatible with the maleimide terminated polyimide resin, a thermally activated free radical curing agent, and electrically conductive particles and / or scrim. Various embodiments add a silane coupling agent and / or an ethylenically unsaturated compound with acid functionality. Methods of using the compositions also are provided.

Description

technical field [0001] The present invention relates to conductive adhesives, including anisotropic conductive adhesives. Background technique [0002] Adhesives capable of establishing multiple sensitive electrical connections between two electronic components are often referred to as anisotropic conductive adhesives. Such adhesives are commonly used to provide an electrical connection between a flex circuit and an electrical substrate. The anisotropic conductive adhesive composition should also: have a short bond time, be able to adhere to a variety of substrates, be able to provide bond lines without voids, have satisfactory storage and shelf life, and maintain flexible circuits with The physical connection between electrical substrates. Anisotropic conductive adhesive compositions should also be easy to manufacture and use. [0003] Some anisotropic conductive adhesive compositions use microencapsulated imidazoles as heat-activated curing agents. These anisotropicall...

Claims

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Application Information

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IPC IPC(8): C09J179/08C09J183/04
CPCH05K2201/0129H05K3/323H05K2201/0154C09J179/08C08L2666/02Y10T428/1345Y10T428/2887Y10T428/2883Y10T428/2852Y10T428/31721C09J9/02
Inventor 埃里克·G·拉森格伦·康奈尔
Owner 3M INNOVATIVE PROPERTIES CO