Centering unit for wafer transfer device
A wafer and wafer-carrying technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as wafer centering failure, wafer returning to the cassette and colliding with fragments, etc., to achieve the effect of ensuring accuracy
Active Publication Date: 2010-06-02
SHENYANG KINGSEMI CO LTD
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Problems solved by technology
[0003] In order to overcome the above problems, the present invention provides a centering unit in the process of wafer transfer, which solves the problems of wafer centering failure, chip collision when the wafer is returned to the cassette, etc.
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[0014] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.
[0015] like Figure 1-2 As shown, the present invention is provided with a wafer centering part 2, a clamping cylinder limiter 3, a vacuum switch valve body 4, a vacuum pipeline 5, a wafer carrying support 6, a clamping cylinder 7, and a clamping cylinder on-off valve body 8, etc., three wafer carrying pillars 6 are arranged on the carrier 9 carrying the processed wafer 1, the inside of the wafer carrying pillar 6 is made into a vacuum channel, and the vacuum channel in the wafer carrying pillar 6 is connected to the The vacuum switch valve body 4 and the wafer carrying pillar 6 are provided with clamping cylinders 7 on both sides, and the clamping cylinder 7 is controlled by the clamping cylinder on-off valve body 8 connected to it. A wafer centering part 2 corresponding to the outer edge of the processed wafer 1 is installed on the clamping cylinder ...
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The invention relates to a centering unit in semiconductor equipment during the process of wafer conveying. The centering unit is particularly applicable to the centering conveying of wafers with thicker glue films, thus solving the problems such as centering failure of the wafer, the occurrence of hit and crush when the wafer returns to a wafer box and the like. The centering unit is provided with a wafer centering component, a wafer bearing pillar and clamping cylinders. The wafer bearing pillar is arranged on a supporting bracket bearing the wafer to be processed and provided with a vacuumpassage communicated with a vacuum line; and two sides of the wafer bearing pillar are provided with the clamping cylinders. The centering unit not only comprises all functions of former centering units, but also is applicable to the centering process of equipment with a relatively thick glue film and thick sealing, thus preventing the center of the wafer from deviation caused by the sticking of glue during the centering process.
Description
Technical field: [0001] The invention relates to a centering unit in the process of wafer transfer in semiconductor equipment, which is especially suitable for centering and transfer of wafers with thick adhesive films. Background technique: [0002] At present, the centering unit of semiconductor equipment is composed of cylinders, wafer carriers, centering guide posts, etc. After the wafer comes out of the cassette, it is centered by the centering unit; After the processing is completed, it is centered by the centering unit and returned to the cassette. When the adhesive film processed by the wafer in the process unit is relatively thick, adhesive often flows down from the edge of the wafer. The viscosity of the glue causes the wafer to shift along with the guide post, so that the alignment fails. When the wafer returns to the cassette, a collision accident occurs, resulting in unnecessary losses. Invention content: [0003] In order to overcome the above problems, the...
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IPC IPC(8): H01L21/68
Inventor 徐春旭
Owner SHENYANG KINGSEMI CO LTD