Grinding apparatus, circuit board substrate test apparatus with grinding component and manufacturing method

Abstract

The invention provides a grinding device, a circuit substrate test device having the grinding device and a method of producing the same; when testing the circuit substrate by using the connector mounted in the circuit substrate, the front end of the connecting terminal of the connector is grinded. The grinding device (10) comprises a grinding part (31) set to oppose to the front end of the connector needle (1T) provided at the connector of the circuit substrate (3); a plurality of needles (30) mounting the grinding part at the front end; a bracket (20) holding the plurality of needles; a force application mechanism (21, 36) for pressing the grinding part to the front end of the connector needle under force application state; and a driving mechanism (15, 19) driving the bracket to cause the bracket to move in the predetermined range, thereby grinding the front end of the connector needle by the grinding part.

Description

technical field [0001] The present application relates to a grinding device, a circuit board testing device with grinding parts, and a circuit board manufacturing method with a grinding step, in particular to a grinding device for grinding a pin head of a connector mounted on a circuit board, and a grinding pin A circuit substrate testing device for testing a circuit substrate, and a circuit substrate manufacturing method having a step of grinding a needle. Background technique [0002] Conventionally, electronic circuits composed of semiconductor components such as ICs and LSIs are formed on circuit boards built into electronic equipment, and before the electronic circuits, especially semiconductor circuits, are incorporated into electronic equipment, an operation test is performed to determine whether they operate normally. This operation test is generally performed with a connector attached to an end portion of a circuit board to be tested. [0003] figure 1 (a) shows a...

AI Technical Summary

Problems solved by technology

First of all, the twisted probe is used to remove the oxide film, and it targets relatively soft items such as flat electrodes and solder balls, but relatively hard items such as spring parts BeCu and BS, which are usually used, and items with non-flat grinding surfaces, It will increase the burden on the twisting mechanism, and in the worst case, it will damage the probe

In addition, the vibration application method does not vibrate the direct contact part, but indirectly vibrates, so there is a problem that it is not clear whether the oxide film on the contact part is removed

In addition, since the vibration is applied while in contact with the object to be measured, it is considered that the object to be measured is damaged, resulting in damage to the probe and a decrease in durability.

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