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Heat radiation module and support member thereof

A technology for heat dissipation modules and supports, applied in electrical components, electric solid devices, semiconductor devices, etc., can solve problems such as damage and deformed capillary structure

Active Publication Date: 2009-08-12
DELTA ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In order to solve the above problems, the present invention proposes a heat dissipation module and its support, which can improve the deformation and damage of the capillary structure of the existing heat dissipation module due to external force and thermal expansion and contraction, and improve the flexibility of product application

Method used

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  • Heat radiation module and support member thereof
  • Heat radiation module and support member thereof
  • Heat radiation module and support member thereof

Examples

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Embodiment Construction

[0032] see figure 2 , figure 2 It is a schematic diagram of a heat dissipation module according to a preferred embodiment of the present invention. Here, special attention should be paid to the fact that in order to clearly show the assembled structure of the heat dissipation module and the heat source, the heat dissipation module is shown upside down. However, in actual use, the figure 2 The structure shown in is then inverted and then placed on the heat source. The heat dissipation module 2 of the present invention includes a support member 20 , a two-phase heat fransfer element 21 and a radiator 23 . The two-phase heat fransfer element 21 is located between the support member 20 and the radiator 23 , and the radiator 23 and the support member 20 together press against the two-phase heat fransfer element 21 up and down.

[0033] Please also see figure 2 and image 3 , image 3 for figure 2 An exploded schematic diagram of the cooling module. The supporting membe...

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PUM

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Abstract

The invention discloses a radiating module and a strutting piece thereof. The radiating module comprises a radiator, a two-phase type heat dissipation element and the strutting piece. The two-phase type heat dissipation element is positioned between the strutting piece and the radiator, and the strutting piece comprises a body which is provided with a bottom and at least two side wall parts, wherein the bottom and the side wall parts form an accommodating space for accommodating the two-phase type heat dissipation element, and the two-phase type heat dissipation element is attached to the bottom.

Description

technical field [0001] The invention relates to a heat dissipation module and its support, in particular to a heat dissipation module which uses the support to fix the two-phase heat transfer element, avoids deformation under the action of temperature and external force, and maintains the consistency of the capillary structure and its supports. Background technique [0002] With the continuous improvement of the performance of electronic products, the heat dissipation module has become one of the indispensable equipment in the current electronic products, because if the heat energy generated by electronic products is not dissipated properly, it will cause poor performance at least, and lead to Burning of electronic products. The heat dissipation module is even more important for microelectronic components, such as integrated circuits (IC), because with the increase of integration and the improvement of packaging technology, the area of ​​integrated circuits is continuously ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/40H01L23/427H01L23/34
Inventor 李证智李钟发黄裕鸿陈锦明
Owner DELTA ELECTRONICS INC