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Electrical conductivity bridge in a conductive multilayer article

A technology of conductive circuits and conductive materials, applied in circuits, printed circuits, electrical components, etc.

Inactive Publication Date: 2009-08-19
KIMBERLY-CLARK WORLDWIDE INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Furthermore, it is difficult to form strong and reliable electrical and mechanical interconnections that are sufficiently resistant to failure due to mechanical stress fatigue generated by movement of the substrate material during the wearer's activities

Method used

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  • Electrical conductivity bridge in a conductive multilayer article
  • Electrical conductivity bridge in a conductive multilayer article
  • Electrical conductivity bridge in a conductive multilayer article

Examples

Experimental program
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Embodiment Construction

[0014] [13] It should be noted that when used in this disclosure, the term "comprises" and other derived terms derived from the root term "comprises" are intended to be open terms which refer to any stated features, elements, integers, steps or The presence of a component is not intended to preclude the presence or addition of one or more other features, elements, integers, steps, components or combinations thereof.

[0015] [14] By the terms "particle", "particle", etc., it is meant a material generally in the form of discrete units. The unit may comprise pellets, powders, spheres, pulverulent materials, etc. and combinations thereof. The particles may have any desired shape, such as square, rod-shaped, faceted, spherical or hemispherical, round or semicircular, angular, irregular, and the like. Shapes with large largest / smallest dimension ratios, like needles, flakes, and fibers, are also considered to be included. The term "particle" or "particle" may also include agglome...

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PUM

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Abstract

A method comprises providing a first electrically-conductive circuit-path (22), and separately providing a second electrically-conductive circuit-path (24). A portion of the first circuit-path is positioned proximally adjacent a portion of the second circuit-path at a first predetermined electrical bond location (26). A first, electrically-insulating barrier layer (28) is interposed between the first circuit-path and second circuit-path at the first bond location, and the first circuit-path is mechanically bonded to the second circuit-path at the first bond location. The mechanical bonding configured to provide an electrically-conductive bond-path between the first circuit-path and the second circuit-path at the first bond location. The mechanical bonding may desirably include ultrasonic bonding and / or pressure bonding.

Description

technical field [0001] [01] The present invention relates to methods of interconnecting circuits. More particularly, the invention pertains to techniques for interconnecting circuits through the thickness of electrically insulating layers. Background technique [0002] [02] Circuits are printed or otherwise applied on flexible substrates such as paper, fabrics, non-wovens and polymer films. Circuits incorporate conductive inks using conventional ink printing techniques, and various products such as badges, labels, and signs incorporate printed circuits. In particular arrangements, printed circuits have been used in hygiene products such as drapes, gowns, garments, personal care absorbent products, and the like. In other arrangements, electrical / electronic circuits have been used to provide sensors in selected personal care products, such as wetness sensors in disposable baby diapers. [0003] [03] However, conventional ink-printed circuit configurations involve printing c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/607A61F13/42
CPCH01L24/72H05K3/4084A61F13/42H01L2924/19043H01L2924/01079H01L2924/01037H05K3/328H01L2924/30105H01L2924/14H01L2924/01019H01L2924/19042H05K2203/0285H01L2924/01078H01L2924/19041H05K2203/1189H01L2924/30107H05K1/11H05K3/40
Inventor D·D·蒂皮T·M·阿勒斯三世T·D·埃勒特
Owner KIMBERLY-CLARK WORLDWIDE INC
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