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Deformation-resistant mounting for a circuit board in a portable device

A portable device and installation structure technology, applied in the directions of support structure installation, elastic/clamping device, circuit arrangement on the support structure, etc., can solve the problem that the deformation of the printed circuit board cannot be prevented, and the external mechanical stress cannot be fully absorbed. , the reduction of the effective area of ​​the printed circuit board, etc.

Inactive Publication Date: 2007-08-22
NEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] Specifically, only a set of long hole shapes or grooves formed around the portion for fixing the printed wiring board to the case cannot prevent the deformation of the printed wiring board, nor can the mechanical stress of the external force be sufficiently absorbed, Also, the effective area of ​​the printed wiring board will be reduced due to the portion formed with a long hole shape or a long groove

Method used

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  • Deformation-resistant mounting for a circuit board in a portable device
  • Deformation-resistant mounting for a circuit board in a portable device
  • Deformation-resistant mounting for a circuit board in a portable device

Examples

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no. 1 example

[0036] Referring to FIGS. 2 to 4 , the boss 106 formed with the preparation hole 102 is disposed at the corner of the housing 101 . The preparation hole 102 is suitable for tap tapping. The preparation holes can also be replaced by threaded holes.

[0037] In order to reduce external mechanical stress applied to the printed wiring board 103 , the holes passed by the screws 105 are long through holes 104 formed on the printed wiring board 103 .

[0038] Specifically, as described above, in the printed wiring board 103 , the long through holes 104 are formed at positions corresponding to the bosses 106 on the housing 101 , as shown in FIGS. 2 and 4 . In the example of the first embodiment, the long through holes 104 are formed in the longitudinal direction at the four corners of the printed wiring board 103 . However, the long through hole 104 may also be formed in a direction perpendicular to the longitudinal direction or in any direction.

[0039] The printed wiring board 1...

no. 2 example

[0041]5A and 5B, in the second embodiment of the present invention, in order to further reduce the external mechanical stress exerted on the printed wiring board 103, a through boss 401 is used, which includes a central portion 402, the central part 402 is formed as a part with a smaller diameter through the long through hole 104 on the printed circuit board 103, and the central part 402 has a preparation hole 102, and the through boss 401 also includes a larger Diameter part 404, this part has a base 403 for mounting printed wiring board 103, although usually printed wiring board 103 is fixed between the boss 106 with the preparation hole 102 and the screw 105. It is desirable to make the inner diameter of the long through hole 104 slightly larger than the outer diameter of the central portion 402 so that the central portion 402 can freely displace in the long through hole 104 .

[0042] In addition, in order to smoothly displace the screw 105 and the center portion 402 in th...

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PUM

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Abstract

Disclosed is a novel deformation-resistant structure of a portable device, capable of reducing an electric failure by decreasing a distortion which occurs in a soldered portion between a printed circuit board of the portable device and an electric part mounted on the board due to a mechanical stress such as drop or pressure. Through slits are formed in positions in a printed wiring plate, which correspond to bosses having prepared holes disposed at the corners of a casing. By inserting screws into the prepared holes through the through slits, the printed circuit board is mounted in the casing. Although the casing is deformed when an external mechanical stress is applied to the casing, the screw and the boss can slide along each of the through slits. Thus, a deformation amount of the printed circuit board is not caused or becomes smaller than that of the casing.

Description

[0001] This application is a divisional application of a patent application with the application number 01139389.0, the application date being November 14, 2001, and the title "Deformation-proof Installation Structure for Portable Devices". technical field [0002] The present invention relates to a printed circuit board of a portable device such as a portable phone, PHS or PDA and a casing structure in which the printed circuit board is installed, in particular to a deformation-proof installation structure of the portable device. Background technique [0003] As portable devices such as portable phones or PDAs become lighter, thinner, and smaller, a user can conveniently carry them in his / her pocket or the like. [0004] Fig. 1 is an exploded perspective view showing a general schematic structure of this prior art. [0005] In FIG. 1, a set of screws 105 are inserted into the through holes 204 of the printed circuit board 203, and screwed into the preparation holes 102 on t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/12H05K7/02H05K5/02H05K5/00H05K1/02H05K7/14
CPCH05K2201/09854H05K2201/10409H05K2201/09063H05K7/142H05K2201/10598H05K1/0271
Inventor 水崎学
Owner NEC CORP
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