Method for manufacturing radiator with radiating fins and structure of radiator

Abstract

The invention relates to a method for manufacturing a radiator with radiating fins and a structure of the radiator, wherein the manufacturing method comprises the following steps: providing a substrate which comprises a base and a plurality of extending arms, and making clearance exist between each extending arm and other two extending arms adjacent to the extending arm; and providing a pluralityof radiating fins, and inserting the radiating fins into the clearance between the extending arms corresponding to the substrate, wherein each radiating fin comprises a base sheet and two heat sinks,and the two heat sinks of each radiating fin are inserted into the clearance between the corresponding extending arm and the other two extending arms adjacent to the extending arm; and bending and pressing Each extending arm of the substrate to make one side wall surface of both opposite side wall surfaces forming each extending arm closely butt against one surface of both opposite surfaces forming each heat sink. The method has the advantage of avoiding losing thermal conduction.

Description

Technical field [0001] The invention relates to a method for manufacturing a radiator with radiating fins and a structure thereof, in particular to a method for manufacturing a radiator with radiating fins and a structure for welding the radiator fins without using solder. Background technique [0002] Heat sinks are widely used. They are generally used in electronic components that generate heat (such as CPU) or lamps (such as halogen, LED lights) to assist in heat dissipation. Among them, heat sinks with heat dissipation fins are used. The most common, figure 1 Shown is a known heat sink, which uses solder 12 on the top surface 111 of the base body 11 and uses reflow to fix a plurality of heat dissipation fins 13 arranged side by side and equidistantly on the top of the base body 11. 面111上. [0003] The purpose of the heat dissipation fins 13 is to greatly increase the heat dissipation area, contact the heat source through the bottom surface 112 of the base body 11, and then quic...

AI Technical Summary

Problems solved by technology

[0004] However, since the heat dissipation fins 13 are welded on the top surface 111 of the base body 11 through the solder 12, and the thermal conductivity of the solder 12 is different from that of the base body 11 and the heat dissipation fins 13, when the heat source is conducted to the heat dissipation fins 13, The solder 12 will cause the loss of heat conduction, making the effect of the heat source conduction to the heat dissipation fins 13 for heat dissipation deteriorated

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