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Copper alloy plate for electrical and electronic components

A technology for copper alloy plates and electronic components, which is applied to electrical components, electrical solid-state devices, circuits, etc., can solve problems such as reducing production efficiency and increasing manufacturing costs, and achieves the effect of improving bending workability.

Active Publication Date: 2009-09-02
KOBE STEEL LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0060] However, in the copper plate production process, especially in the casting and melting process, etc., the content of hydrogen, oxygen, etc. is more aggressively reduced to a very small amount, which will increase the production cost and reduce the production efficiency even in the copper plate production process.
Therefore, Cu-Fe-P-based copper alloys are difficult to avoid containing a certain degree of hydrogen and oxygen during the casting and melting process.
[0061] Therefore, in the Cu—Fe—P-based copper alloy, the coarse-grained inclusions (oxides and crystallized substances) generated in the melting and casting process remain on the finished board, and it is difficult to avoid the appearance of through holes caused by hydrogen as surface defects.

Method used

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  • Copper alloy plate for electrical and electronic components
  • Copper alloy plate for electrical and electronic components
  • Copper alloy plate for electrical and electronic components

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Experimental program
Comparison scheme
Effect test

no. 1 approach

[0118]

[0119] (Surface roughness)

[0120] In the present invention, as a prerequisite for the surface roughness of the Cu—Fe—P-based copper alloy sheet, the centerline average roughness Ra is set to be 0.2 μm or less, and the maximum height Rmax is set to 1.5 μm or less. It is preferable to set the centerline average roughness Ra to be 0.1 μm or less, and to set the maximum height Rmax to be 1.0 μm or less.

[0121] If the centerline average roughness Ra exceeds 0.2 μm, or the maximum height Rmax exceeds 1.5 μm, the surface of the Cu—Fe—P based copper alloy plate will become rough instead of smooth, hindering the basic characteristics required for the lead frame. That is, thermal bonding of Ag paste or the like to the lead frame semiconductor chip, plating of Au, Ag, etc., solder or Ag brazing, etc. will be hindered. In addition, it is also difficult to control the Rku on the surface of the Cu—Fe—P based copper alloy sheet to 5.0 or less by cleaning treatment involving ...

no. 2 approach

[0174]

[0175] (r value)

[0176]In the present invention, as described above, in order to improve the bending workability of a Cu—Fe—P based copper alloy sheet having a tensile strength of 500 MPa or more and a hardness of 150 Hv or more, the rolling direction of the copper alloy sheet is parallel to the rolling direction. The r value is set to 0.3 or more. The r value is preferably not less than 0.35 and not more than 0.5.

[0177] As described above, in the Cu-Fe-P-based copper alloy sheet whose strength is increased by the increase in the amount of work hardening due to the increase in the processing rate of the cold rolling, the crystal grains have a large width in the rolling direction. (Growth) Elongated crystal orientation with large anisotropy.

[0178] As a result, in the cold-rolled Cu—Fe—P-based copper alloy sheet, the r value in the direction perpendicular to the rolling direction tends to be higher than the r value in the horizontal direction relative to the...

no. 3 approach

[0210]

[0211] Next, the meaning and embodiment of each requirement in the Cu—Fe—P based copper alloy sheet of the present invention for satisfying required characteristics for semiconductor lead frames and the like will be specifically described.

[0212] (Composition of Copper Alloy Sheet)

[0213]In the present invention, for semiconductor lead frames and the like, it is preferable to have basic characteristics such as high strength such as a tensile strength of 500 MPa or more and a hardness of 150 Hv or more. Furthermore, on the basis of satisfying these basic properties, or on the premise of not degrading these basic properties, good stampability can be realized. Therefore, as a Cu—Fe—P-based copper alloy sheet, the following basic composition is made, that is, the content of Fe is in the range of 0.01 to 0.50%, and the content of P is in the range of 0.01 to 0.15%. The balance is composed of Cu and unavoidable impurities.

[0214] In the present invention, elements...

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Abstract

Provided is a highly strong Cu-Fe-P based copper alloy plate having improved oxide film adhesiveness to solve the problems of package cracks and peeling. The copper alloy plate for electrical and electronic components contains Fe of 0.01-0.50% and P of 0.01-0.15% in mass %, and the rest is composed of Cu and unavoidable impurities. The copper alloy plate has a center line average roughness Ra of 0.2[mu]m or less in surface roughness measurement conforming to the JIS B0601 Standards, a maximum height Rmax of 1.5[mu]m or less, and a kurtosis RKu of a roughness curve of 5.0 or less.

Description

technical field [0001] The present invention relates to: (1) a Cu-Fe-P based copper alloy plate with high strength and improved oxide film adhesion to deal with package cracks and peeling problems; (2) a Cu alloy plate with high strength and excellent bending workability. -Fe-P-based copper alloy sheet, (3) Cu-Fe-P-based copper alloy sheet with high strength and excellent stampability during stamping, and (4) Cu-Fe-based high-strength and excellent platability P series copper alloy plate. The copper alloy sheet of the present invention is suitable as a raw material for a lead frame for a semiconductor device, and is also suitable as a material for electric and electronic parts such as other semiconductor parts and printed circuit boards, switch parts, busbars, etc. Used in various electrical and electronic components such as mechanical components such as terminals and connectors. However, in the following description, as a typical application, the case where it is used for a...

Claims

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Application Information

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IPC IPC(8): C22C9/00C22C9/01C22C9/02C22C9/05C22C9/06C22C9/04C22F1/00C22F1/08
CPCH01L2924/0002
Inventor 有贺康博尾崎良一三轮洋介
Owner KOBE STEEL LTD
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