Copper alloy having high strength, high electroconductivity and superior bend formability, and manufacturing method therefor

Abstract

The present invention relates to a copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% ofNi; 0.05 to 1.0% of Si; and, as an element M, one member selected from 0.005 to 0.5% ofP, 0.005 to 1.0% of Cr, and 0.005 to 1.0% of Ti, with the remainder being copper and inevitable impurities, in which an atom number ratio M / Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer. According to the invention, it is possible to provide a copper alloy having high strength, high electrical conductivity, and excellent bendability.

Description

technical field [0001] The present invention relates to a copper-nickel-silicon-based alloy having high strength, high electrical conductivity, and excellent bendability, for example, an excellent copper alloy used as semiconductor components such as home appliances, lead frames for semiconductor devices, and printed circuit boards. Copper alloy strips such as electrical and electronic parts materials, switch parts, structural parts such as busbars, terminals and binding posts, and industrial equipment. Background technique [0002] Along with the demand for miniaturization and weight reduction of electronic equipment, electrical and electronic parts are being miniaturized and reduced in weight. In addition, for the miniaturization and weight reduction of the electric and electronic parts and the miniaturization and weight reduction of the terminal parts, the thickness and width of the copper alloy material used for these parts are also reduced, and in the IC, also A thin c...

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Problems solved by technology

However, the content of Ni and Si is basically too much, so the conductivity is insufficient

[0029] In Patent Document 7, although the extended shape of the crystal grains of the surface structure of the copper plate is specified, sufficient strength cannot be obtained only by the shape of the crystal grains, and the control of the solid solution process is not sufficient, so the electrical conductivity is insufficient.

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