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Liquid material vaporizer

A technology of gasification device and gasification part, which is applied in the direction of gas generation device, evaporation device, gaseous chemical plating, etc., can solve the problem of uneven spray concentration, achieve the effect of inhibiting the clogging of pores and reducing the risk of complete stop of action

Active Publication Date: 2009-09-02
HORIBA STEC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since there is a space between the heating flow path and the nozzle due to discontinuity, the spray concentration unevenness caused by the difference in the overlap of the spray sprayed from the nozzle also occurs. The problem

Method used

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  • Liquid material vaporizer
  • Liquid material vaporizer
  • Liquid material vaporizer

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Embodiment Construction

[0035] An embodiment of the present invention will be described below with reference to the drawings.

[0036] The gasification device A of this embodiment constitutes, for example, a part of a semiconductor manufacturing system (not shown), is connected to a vacuum chamber (not shown) for film formation, and supplies raw materials for forming semiconductor elements in a gaseous state. role.

[0037] Such as figure 1 As shown, specifically, the gasification device is equipped with: a gas-liquid mixing mechanism 1 that mixes the raw material (hereinafter also referred to as liquid raw material) LM in a liquid state with a carrier gas CG to generate a gas-liquid mixture GL; and The liquid raw material LM contained in the gas-liquid mixture GL is vaporized so that it is in a gaseous state (hereinafter also referred to as raw material gas), and the raw material gas GS is led out together with the carrier gas CG to the outside, that is, to the vacuum chamber. Main Body 2.

[00...

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PUM

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Abstract

A vaporizer comprises an introduction port (P1) for introducing material in liquid phase or gas-liquid mixture phase, a vaporizing section (3) for vaporizing the material provided on the downstream side of the introduction port (P1), and a delivery port (P2) for delivering the material vaporized at the vaporizing section (3), wherein the vaporizing section (3) is of a channel type and consists of a nozzle (31) for spraying the material and a heating path (32) provided on the downstream side of the nozzle (31) continuously thereto. A plurality of vaporizing sections (3) are provided in parallel between the introduction port (P1) and the delivery port (P2), and arranged such that each vaporizing section (3) can distribute the material independently of each other. The vaporizer which prevents deterioration of raw material while reducing residue, can expect reduction in risk of choking, and can increase vaporization flow rate easily.

Description

technical field [0001] The present invention relates to a gasification device for gasifying various liquid raw materials and the like used in, for example, semiconductor manufacturing processes. Background technique [0002] In conventional gasification devices of this type, a gas-liquid mixture composed of a liquid raw material for film formation and a carrier gas is released from a nozzle, depressurized, and heated through a heating channel provided downstream of the nozzle. Gasification of a liquid raw material (Patent Document 1). [0003] However, among liquid materials that are often used as raw materials for high-k processes of recent semiconductor devices, there are substances that have low vapor pressure and are easily thermally decomposed. As a result, conventional vaporizers have the following problems. [0004] That is, such a liquid raw material has a low vapor pressure, so it must be set to a high temperature for gasification, but because it is easily thermall...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/31B01J7/02
CPCB01B1/005B01B1/06C23C16/4486B01J7/02
Inventor 西川一朗河野武志
Owner HORIBA STEC CO LTD
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