Microwave feeder unit used for sealing semiconductor electric absorption modulator

Abstract

The invention provides a microwave feeder unit used for sealing a semiconductor electric absorption modulator, belonging to the sealing technical field of semiconductor electric absorption modulator in optoelectronic devices. The microwave feeder unit is characterized in that in a coplanar waveguide transmission line structure, through holes for conducting a coplanar waveguide metal earth electrode on a heat sink upper surface and a metal earth electrode on a lower surface are opened along the longitudinal direction at the two sides of a longitudinal axis of the coplanar waveguide metal earthelectrode. The smallest resonance peak and the transmission characteristics of the heat sink transmission are changed according to the quantity and the position of the through holes. Simultaneously, the microwave feeder unit is cut into two parts along the direction vertical to the longitudinal axis so as to facilitate the sealing test of the semiconductor electric absorption modulator. The microwave feeder unit used for sealing the semiconductor electric absorption modulator has excellent transmission characteristics within 60GHz, the transmission loss is less than 0.5dB, and no resonance peak phenomenon appears.

Description

technical field [0001] The invention belongs to the field of optoelectronic devices, and more specifically relates to a microwave feeder unit for semiconductor electroabsorption modulator packaging. Background technique [0002] In the current optical fiber communication system, the semiconductor electroabsorption modulator has been widely used and paid attention to because of its small size, high modulation bandwidth, and theoretically its modulation rate can reach 100Gb / s. Transition heat sinks play an important role in optoelectronic device packaging. But during testing and packaging, microwave coupling of the modulating signal to the modulator electrodes limits the final modulation bandwidth. Therefore, it is necessary to develop high-performance waveguide conversion and microwave matching circuits to realize low-loss transmission of microwave signals from the coaxial interface to the modulator electrodes. At present, the transitional heat sink mainly uses a coplanar w...

AI Technical Summary

Problems solved by technology

[0003] In order to solve the above problems, the object of the present invention is to provide a microwave feeder unit for semiconductor electroabsorption modulator packaging, the heat sink can solve the problem of high frequency microwave resonance in the coplanar waveguide transmission structure

At the same time, it can also solve the problem that the matching resistance of the microstrip line transmission structure is troublesome to manufacture, and it is not easy to test during the packaging process.

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