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Technology for processing semi-hole of PCB board

A PCB board and hole processing technology, applied in the direction of electrical connection formation of printed components, etc., can solve problems such as incomplete functions, decline in production enterprise product yield, and affect product performance, so as to avoid pull-off or defect, reduce enterprise cost, The effect of improving product yield

Active Publication Date: 2009-09-30
SHENZHEN BOMIN ELECTRONICS
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  • Summary
  • Abstract
  • Description
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AI Technical Summary

Problems solved by technology

In this way, when the via hole is formed, the round hole is electrically milled into half, and the copper on the wall of the half hole is likely to be pulled off or damaged, resulting in incomplete functions, affecting the performance of the product, and resulting in a decline in the product yield of the manufacturer. cost increase

Method used

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Embodiment Construction

[0017] The present invention will be further explained by describing the specific steps of the manufacturing process of the half-hole plate below.

[0018] PCB half-hole processing technology is implemented through the following technical solutions:

[0019] 1. Drilling: Use a drilling machine to drill out the conduction holes of the interlayer circuit and the plug-in holes of the welding parts on the substrate. When drilling, fix the base plate on the drilling machine table through the target hole, and add a flat lower backing plate and upper cover plate to reduce the occurrence of drilling edge.

[0020] 2. Immersion Copper: After the interlayer via hole is drilled, a layer of copper needs to be deposited on the hole wall to complete the conduction of the interlayer circuit. First, clean the shavings on the orifice and the powder in the hole by mechanical brushing and high-pressure washing, and then remove the residual glue on the wall of the hole with alkaline potassium pe...

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PUM

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Abstract

The invention relates to a process for manufacturing a PCB board, in particular to technology for processing a PCB board provided with a semi-hole. Aiming at avoiding the phenomenon that copper on the hole wall is pulled off or damaged when the semi-hole is formed, the process that the electric milling of the semi-hole is added before etching and after film removal of a line is adopted, and the semi-hole and the external shape are not completed at the same time when the PCB board is formed. By the process that the electric milling of the semi-hole is added before etching and after film removal of the line, the electric milling is performed when the copper is fully connected with the copper on the hole wall in 360 degrees, thereby avoiding the phenomenon that the copper on the hole wall is pulled off or damaged when the semi-hole is formed, improving the yield of products and lowering cost of an enterprise.

Description

Technical field: [0001] The invention relates to a manufacturing process of a PCB board, in particular to a manufacturing process of a PCB board provided with a half hole. Background technique: [0002] PCB is the abbreviation of English (Printed Circuie Board) printed circuit board. Usually, the conductive pattern made of printed circuit, printed component or a combination of the two is called printed circuit on the insulating material according to the predetermined design. The conductive pattern that provides electrical connection between components on an insulating substrate is called a printed circuit. In this way, the finished board of printed circuit or printed circuit is called printed circuit board, also known as printed board or printed circuit board. [0003] A via hole refers to a hole on a multilayer circuit board that is only used for conductive interconnection between layers, and is generally no longer used for plug-in soldering of component pins. This type ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/42
Inventor 王强黄李海陆景富
Owner SHENZHEN BOMIN ELECTRONICS
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