Radiating module and electronic device provided with same

Abstract

The invention relates to a radiating module and an electronic device provided with same. The electronic device comprises a circuit board and a radiating module, wherein the circuit board is provided with a plurality of heating elements, and the radiating module comprises a radiating board and a heat pipe group. The radiating board is arranged on the circuit board, is divided into a plurality of contact parts and at least one heat pipe protecting part connected with the contact parts, and has a first surface and a second surface; the contact parts are used for receiving heat from the heating elements; a heat pipe containing groove which passes through the heat pipe protecting part is arranged on the first surface; and the heat pipe group is arranged in the heat pipe containing groove of theradiating plate.

Description

technical field [0001] The present invention relates to a heat dissipation module and an electronic device with the heat dissipation module, and in particular to a heat dissipation module capable of simultaneously dissipating heat from a plurality of heat generating elements (Heat Generating Elements) located on a circuit board (Circuit Board) And an electronic device with the cooling module. Background technique [0002] In recent years, with the rapid development of computer technology, the operating speed of the computer has been continuously increased, and the heat generation rate of the electronic elements (Electronic Elements) in the computer mainframe has also been continuously increased. In order to prevent the electronic components inside the computer mainframe from being overheated, resulting in temporary or permanent failure of the electronic components, how to provide sufficient cooling performance for the electronic components inside the computer is very importa...

AI Technical Summary

Problems solved by technology

However, during the transportation of the heat dissipation module, the heat pipe is easily bent and deformed by vibration or improper external force

In addition, during the process of installing the heat dissipation module to the motherboard, the heat pipe is also easily bent and deformed due to improper operation by the operator

Once the heat pipe is bent and deformed, it will lead to poor heat dissipation efficiency of the cooling module

In addition, the heat dissipation module whose heat pipe is bent and deformed is not easy to be effectively assembled on the motherboard, so that some heat sinks cannot be properly attached to the heating element, which seriously affects the heat dissipation efficiency

In addition, if the heat dissipation module is forced to be installed on the motherboard so that the heat sink and the heating element fit together, the motherboard may be bent and deformed, and even the circuits or components on the motherboard may be damaged.

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