Wafer socket and method for detecting horizontal positioning of wafer

A technology for horizontal positioning and chip application in measuring devices, surveying and navigation, measuring inclination, etc., which can solve problems such as damage to the chip 22, inaccurate positioning of the chip in the chip socket, and inability to obtain test results, etc., to achieve the effect of avoiding damage
CN101577393AInactive Publication Date: 2009-11-11KING YUAN ELECTRONICS
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
KING YUAN ELECTRONICS
Publication Date
2009-11-11
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a wafer socket and a method for detecting horizontal positioning of wafer. The wafer socket comprises a base and an assembly, wherein the base is provided with a positioning surface for accommodating the wafer and two pairs of optical inductors are respectively arranged in the assembly and are close to regions of two diagonal lines so as to detect whether the wafer is horizontally positioned. The invention aims at ensuring that the wafer is placed at the right place so as to prevent the wafer from being damaged during the test and ensure that the test can be smoothly performed.
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Description

technical field

[0001] The invention relates to a wafer socket, in particular to a wafer socket capable of detecting whether the wafer is positioned horizontally. Background technique

[0002] The function of the IC socket is to electrically connect a plurality of protruding terminals (pins or leads) of the chip to a plurality of soldering pads (pads) of the circuit board for testing. Chip sockets are consumables, and can also be replaced according to the type of test chip. Therefore, a well-designed chip socket must be easy to replace.

[0003] In addition to easy replacement, whether the chip is placed in the correct position is also an important issue. Such as figure 1 As shown, US Pat. No. 5,100,332 discloses a wafer socket comprising a base 1 and an upper cover 2 . The base 1 has a bearing surface 3 with grooves for accommodating wafers to be tested (not shown); The wafer socket is characterized in that the four corners of the base 1 have a V-shaped recessed structu...

Claims

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