Check patentability & draft patents in minutes with Patsnap Eureka AI!

Microchip and process for producing microchip

A manufacturing method and microchip technology, applied in chemical instruments and methods, manufacturing microstructure devices, microelectronic microstructure devices, etc., can solve problems such as high cost and glass substrates are not suitable for mass production, and achieve the effect of preventing leakage

Inactive Publication Date: 2009-11-25
KONICA MINOLTA OPTO
View PDF4 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since glass substrates are not suitable for mass production and are very expensive, development of inexpensive and disposable resin microchips is desired

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Microchip and process for producing microchip
  • Microchip and process for producing microchip
  • Microchip and process for producing microchip

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0043] refer to figure 1 A microchip according to a first embodiment of the present invention and a method of manufacturing the microchip will be described. figure 1 is a cross-sectional view of the microchip according to the first embodiment of the present invention.

[0044] (Structure of Microchip)

[0045] The microchip according to the first embodiment is configured to have a microchip substrate 10 and a microchip substrate 14 . Groove-shaped fine flow paths 11 are formed on the microchip substrate 10 . Further, a through-hole penetrating the substrate is formed in the microchip substrate 10 . The through hole is formed in contact with the fine flow path 11 , and becomes the opening 12 by joining the microchip substrate 10 and the microchip substrate 14 . The microchip substrate 14 to be bonded to the microchip substrate 10 is a planar substrate. The microchip substrate 10 and the microchip substrate 14 are bonded with the surface on which the fine channel 11 is form...

no. 2 approach

[0099] Next, refer to figure 2 A microchip and a method of manufacturing the microchip according to the second embodiment of the present invention will be described. figure 2 is a cross-sectional view of a microchip according to a second embodiment of the present invention. A through-hole is formed in the microchip substrate serving as the lid in the second embodiment.

[0100] The microchip according to the second embodiment is configured to have a microchip substrate 20 and a microchip substrate 22 . Groove-shaped fine flow paths 21 are formed on the microchip substrate 20 . The microchip substrate 22 to be bonded to the microchip substrate 20 is a planar substrate. In the second embodiment, through-holes are formed in the microchip substrate 22 . The microchip substrate 20 and the microchip substrate 22 are bonded with the surface on which the fine channel 21 is formed as the inner side. Thus, the microchip substrate 22 is used as a cover for the fine channel 21 , an...

no. 3 approach

[0108] Next, refer to image 3 A microchip and a method of manufacturing the microchip according to a third embodiment of the present invention will be described. image 3 is a cross-sectional view of a microchip according to a third embodiment of the present invention. In the third embodiment, through-holes are formed in a microchip substrate in which fine flow paths are formed, and two layers of dielectric films are formed in openings.

[0109] (Structure of Microchip)

[0110] The microchip according to the third embodiment is configured to have a microchip substrate 30 and a microchip substrate 35 . Groove-shaped fine flow paths 31 are formed on the microchip substrate 30 . Further, a through hole penetrating the substrate is formed in the microchip substrate 30 . The through hole is formed in contact with the fine flow path 31 , and the opening 32 is formed by joining the microchip substrate 30 and the microchip substrate 35 . The microchip substrate 35 to be bonded ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A microchip in which any inter-substrate gap in the vicinity of aperture provided therein can be infilled so as to prevent leakage of a reagent, etc. The microchip comprises microchip substrate (10) and microchip substrate (14). The microchip substrate (10) is furnished with groovelike microchannel (11) and a through-hole. The microchip is produced by joining the microchip substrate (10)with the microchip substrate (14). Aperture (12) is connected to the microchannel (11), and through the aperture (12), there are carried out, for example, introduction of a reagent, etc. and discharge of a reagent, etc. The aperture (12) on its internal surface is provided with dielectric film (13). A SiO2 film or TiO2 film is used as the dielectric film (13).

Description

technical field [0001] The present invention relates to a microchip in which channel grooves are formed, and a method for manufacturing the microchip. Background technique [0002] Micro-analysis chips or μTAS ( Micro Total Analysis Systems) devices are being put into practical use. Advantages of such a microchip include reducing the amount of samples and reagents used and the amount of waste liquid discharged, saving space, and being an inexpensive system that can be carried and transported. [0003] A microchip is manufactured by bonding two parts in which at least one part has been microfabricated. Conventionally, a glass substrate is used for a microchip, and various microfabrication methods have been proposed. However, since glass substrates are not suitable for mass production and are very expensive, development of inexpensive and disposable resin microchips has been desired. [0004] Here, refer to Image 6 as well as Figure 7 The structure of a microchip accord...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01N35/08B01J19/00G01N37/00
CPCB01L2300/0816B81B2201/051B01L2200/027B01L3/502707B01L2200/0689B01L2300/16B01L2200/12B81C1/00071B81C2201/019B01L2300/0887
Inventor 平山博士
Owner KONICA MINOLTA OPTO
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com