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Embedded circuit board radiating device and processing method of element

A technology of heat dissipation device and processing method, which is applied in the direction of circuit heat device, circuit, printed circuit connected with non-printed electrical components, etc., to achieve the effect of improving heat dissipation efficiency and solving heat dissipation problems

Inactive Publication Date: 2009-12-02
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Embodiments of the present invention provide a device-embedded circuit board heat sink and a device-embedded circuit board heat sink processing method to solve the problem of heat dissipation for embedded high-power devices

Method used

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  • Embedded circuit board radiating device and processing method of element
  • Embedded circuit board radiating device and processing method of element
  • Embedded circuit board radiating device and processing method of element

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Embodiment Construction

[0015] Embodiments of the present invention provide a device-embedded device-embedded circuit board heat dissipation method and a device-embedded circuit board heat dissipation device. A cooling groove is provided on the outer surface of the device cavity of the device-embedded circuit board. The cooling A heat pipe is laid inside the tank or the cooling tank forms a closed pipeline capable of containing circulating liquid, and the device is dissipated through the heat pipe or the circulating liquid takes away the heat of the device, so as to maximize the heat dissipation efficiency and solve the problem of buried devices in embedded devices. The heat dissipation problem of the embedded circuit board.

[0016] The technical solution of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0017] figure 1 The first device-embedded device-embedded circuit board heat dissipation device provided by the embodiment of the present i...

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Abstract

The embodiment of the invention relates to the field of electronic equipment and provides an embedded circuit board radiating device and a processing method of an element. The outer surface of an element cavity is provided with a cooling tank, heat pipes are laid in the cooling tank or the cooling tank forms a seal pipeline which can accommodate circulating liquid, and the element is radiated by the heat pipes or the heat of the element is brought away by the circulating liquid. The invention furthest improves the radiating efficiency and solves the radiating problem of the embedded element and the embedded circuit board of the element.

Description

technical field [0001] The invention relates to the field of electronic equipment, in particular to a device-embedded circuit board heat sink and a processing method for the device-embedded circuit board heat sink. Background technique [0002] High-density integration is one of the development trends of electronic products. Assembling devices in the three-dimensional direction of device-embedded circuit boards (device-embedded circuit boards) to build device-embedded circuit boards has become the development direction of the future electronics industry. one. However, when devices, especially high-power devices, are embedded in circuit boards, the heat dissipation of devices will become an application bottleneck. Contents of the invention [0003] Embodiments of the present invention provide a device-embedded circuit board heat sink and a processing method of the device-embedded circuit board heat sink, so as to solve the problem of heat dissipation for embedded high-powe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/18H05K3/00H05K7/20H01L25/00H01L23/538H01L23/34H01L23/427H01L23/473H01L21/50H01L21/48
CPCH05K3/4611H01L2924/0002H05K2201/064H01L23/473H01L23/427H05K1/185H01L24/19H05K3/4644H05K1/0272H01L2924/19105H05K1/0203H01L23/5389
Inventor 陈利民宗晅谢德才
Owner HUAWEI TECH CO LTD
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