Method of machining u-shaped groove of substrate of fragile material, removal method, boring method and chamfering method using the same method

Abstract

A method of easily forming a linear or curved continuous or discontinuous U-shaped groove on a substrate surface, and a chamfering method using the same. Part of the surface of a substrate made of a fragile material is rapidly heated under laser irradiation conditions for forming the U-shaped groove consisting of a predefined combination of laser power, a laser irradiation area and scanning speed according to a substrate material to be machined, a groove width of the U-shaped groove to be formed, a depth and a shape of a groove surface, thereby exfoliating part of the substrate from the surface and forming the U-shaped groove. A chamfered face comprising a groove surface constituted of part of the U-shaped groove formed between an end surface segmented from an expected segmentation line and the substrate surface is formed by a method of scribing from an initial end of the expected segmentation line set on the bottom of the groove toward a terminal end by means of laser crack growth, a method of scribing by means of a cutter wheel or the like.

Description

technical field [0001] The present invention relates to a method for forming a U-shaped groove by rapidly heating a part of the surface of a substrate made of a brittle material, peeling off a part of the substrate from the surface, and performing removal processing or drilling processing on an object to be processed using the method Methods. Background technique [0002] For example, on a processing table of a precision machine, a brittle material substrate such as a glass substrate is used due to the property of a small linear expansion coefficient. Usually, this kind of processing table is composed of an upper mold and a lower mold, and an oil storage groove or a cooling channel for improving lubricity is formed on the contact surface of the upper mold and the lower mold. In order to form the oil storage groove or the cooling passage, it is necessary to form grooves on the glass substrate. In addition, mechanical methods and chemical methods are generally known as metho...

AI Technical Summary

Problems solved by technology

As a result, near the edge line 11 irradiated by the laser beam, the cracks generated by the thermal stress continue to grow, thereby forming an arc-shaped chamfered surface 14, but the laser beam is first irradiated to the edge line 10 of the glass substrate 10. end of P B Irregular residual areas formed nearby17

Even if the irradiation angle and irradiation conditions of the laser beam to the substrate 10 are varied, it is difficult to completely eliminate the residual area.

In addition, since the symmetry of the temperature distribution near the edge line is poor, it is difficult to form a stable chamfered surface 14, and defects such as microcracks may occur.

Images