Folding self-die substrate integrated waveguide

A half-mode substrate integration and waveguide technology, which is applied in the direction of waveguides, waveguide devices, printed circuit components, etc., can solve the problems of large size and achieve high Q value, low loss, and high Q value

Inactive Publication Date: 2009-12-30
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, compared with the microstrip line structure, the size of the structure in the low frequency band is larger

Method used

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  • Folding self-die substrate integrated waveguide
  • Folding self-die substrate integrated waveguide
  • Folding self-die substrate integrated waveguide

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Embodiment 1 Folded half-mode substrate integrated waveguide

[0023] image 3 It is a folded half-mold substrate integrated waveguide with slots etched on the upper metal surface,

[0024] Figure 4 It is a folded half-mode substrate integrated waveguide with slots etched on the metal surface of the middle layer,

[0025] Figure 5 It is the actual test result of the first filter in the first embodiment of the present invention,

[0026] Image 6 It is the actual test result of the second filter in the first embodiment of the present invention,

[0027] Table 1 is the size of the first filter in Embodiment 1,

[0028] Table 2 shows the dimensions of the second type of filter in Embodiment 1.

[0029] Table I

[0030]

[0031] Table II

[0032]

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PUM

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Abstract

The invention relates to a folding self-die substrate integrated waveguide which can be applied to the design of microwave millimeter wave circuits or the design of microwave millimeter wave integrated circuits. A filter is in a multi-layered structure and respectively comprises a front metal patch (3), an upper medium substrate (1), a middle metal layer (4), a lower medium substrate (2) and a bottom metal layer (5) from top to bottom, wherein an input end (8) and an output end (9) are respectively arranged at both ends of a self-die substrate integrated waveguide; a row of first metalized through holes (7) is arranged at one side of the upper medium substrate (1) and the lower medium substrate (2) of the self-die substrate integrated waveguide to form the side wall of the waveguide and is connected with the front metal patch (3), the middle metal layer (4) and the bottom metal layer (5); another row of second metalized through holes (6) is arranged at the other side of the lower medium substrate (2) and is connected with the middle metal layer (4) and the bottom metal layer (5) to form the H-surface metal wall of the waveguide; and the filter is provided with groove gaps (10) on the front metal patch (3) or the middle metal layer (4).

Description

technical field [0001] The folded half-mode substrate integrated waveguide filter can be applied to the design of microwave and millimeter wave circuits, and can also be used in the design of microwave and millimeter wave integrated circuits, belonging to the technical field of microwave filters. Background technique [0002] Among existing millimeter-wave and microwave devices, substrate-integrated waveguides and half-mode substrate-integrated waveguide structures combine the advantages of microstrip lines and rectangular waveguides: planarization, low cost, low profile, easy integration, and low loss. However, compared with the microstrip line structure, the size of the structure in the low frequency band is larger. The area of ​​the folded half-mode substrate integrated waveguide is half of that of the half-mode substrate integrated waveguide, and a quarter of that of the substrate integrated waveguide, which further reduces the area and improves the integration degree of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P3/16H01P3/18H01P1/20H05K1/02
Inventor 翟国华洪伟吴柯
Owner SOUTHEAST UNIV
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