140 results about "Millimeter wave circuits" patented technology

A microwave circuit or a millimeter wave circuit is formed on a semiconductor chip. A multilayer substrate is formed of a first dielectric layer, a second dielectric layer and a third dielectric layer. A high-frequency circuit line with the semiconductor chip mounted thereon is formed on the third dielectric layer. A slot hole is formed on one side of the second dielectric layer and an antenna feeding line is formed on the other side. The first dielectric layer has a plurality of slot holes formed therein that radiate electromagnetic waves. An organic substrate is laminated to the multilayer substrate by an adhesion layer.

The invention discloses a millimeter wave folding-type reflective array antenna integrated with a plane feed source. The millimeter wave folding-type reflective array antenna is of a layered structure and is sequentially provided with a polarization grid, a reflective array and the plane feed source from top to bottom. On the basis of a plane substrate integration waveguide structure, a substrate integration waveguide gap array antenna is used as the feed source for conducting feed on folding-type reflection, phase compensation is obtained on a reflection face, spherical waves are converted to plane waves, and therefore the antenna which is high in gain and efficiency and stable in beam pointing is realized. Under the Q-LINKPAN application background and directing at the development demands of a plane-integration and miniaturized long-distance wireless communication system, the low-section antenna which is high in gain and efficiency and capable of being integrated with a plane millimeter wave circuit is realized, the millimeter wave folding-type reflective array antenna has the advantages of being simple in structure, compact in size and low in cost, and the requirements for plane circuit integration are met.

A laminate multilayer ball-grid-array package is suitable for millimeter-wave circuits. The frequency bandwidth of the package is DC to 40 GHz. The package is made using laminate circuit board materials to match the temperature expansion coefficients of the package to the host PCB. Electrical connection between the package and the host PCB on which the package is mounted is achieved using ball-grid-array technology. The package can be sealed, covered, or encapsulated, and is suitable for high-volume production.

The invention discloses a substrate integrated waveguide split ring resonator-based microwave band pass filter. The microwave band pass filter comprises a substrate integrated waveguide which is formed by fixing two rows of metal members on a dielectric substrate, wherein the two ends of the substrate integrated waveguide are connected with a micro-strip feed line respectively; the surfaces of both the micro-strip feed line and the substrate integrated waveguide are made of metal dielectric; the upper surface of the substrate integrated waveguide is positioned between the two rows of metal members to corrode an m*n split ring resonator array; and a row of dumbbell-shaped area bodies or dumbbell-shaped deformation areas are corroded corresponding to each line of split ring resonators on the lower surface of the substrate integrated waveguide between the two rows of metal members. The band pass filter has the advantages of out-of-band steep attenuation, small volume, light weight and high power capacity and is easy to be integrated with other planar microwave and millimeter-wave circuits, so that the band pass filter is expected to be applied to the microwave and millimeter-wave integrated circuit or a millimeter wave integrated circuit.

The invention relates to a folding self-die substrate integrated waveguide which can be applied to the design of microwave millimeter wave circuits or the design of microwave millimeter wave integrated circuits. A filter is in a multi-layered structure and respectively comprises a front metal patch (3), an upper medium substrate (1), a middle metal layer (4), a lower medium substrate (2) and a bottom metal layer (5) from top to bottom, wherein an input end (8) and an output end (9) are respectively arranged at both ends of a self-die substrate integrated waveguide; a row of first metalized through holes (7) is arranged at one side of the upper medium substrate (1) and the lower medium substrate (2) of the self-die substrate integrated waveguide to form the side wall of the waveguide and is connected with the front metal patch (3), the middle metal layer (4) and the bottom metal layer (5); another row of second metalized through holes (6) is arranged at the other side of the lower medium substrate (2) and is connected with the middle metal layer (4) and the bottom metal layer (5) to form the H-surface metal wall of the waveguide; and the filter is provided with groove gaps (10) on the front metal patch (3) or the middle metal layer (4).

The invention relates to a small broadband substrate integrated waveguide planar magic-T structure, which comprises an upper layer of metal surface, a middle layer of metal surface and a lower layer of metal surface of a dielectric substrate. The dielectric substrate is provided with two rows of parallel metal posts, and a slot line structure etched out from the middle layer of metal surface so as to greatly realize the energy transmission from a microstrip line to substrate integrated waveguide (SIW). The adopted equal power division network of the substrate integrated waveguide (SIW) replaces the traditional branch structure, so that the volume of the whole planar magic-T structure is decreased to a half of the volume of the past substrate integrated waveguide (SIW) planar magic-T structure, the relative bandwidth of work of the magic-T is greatly increased, and the planar magic-T structure has good isolation characteristics with a difference arm and an equal power division port. The small broadband substrate integrated waveguide (SIW) planar magic-T has simple design, small volume and good electrical property and is easy to be integrated with other planar microwave millimeter wave circuits.

The invention relates to the technical field of wireless communication equipment, and specifically relates to an integrated millimeter wave tile type TR component. The integrated millimeter wave tiletype TR component comprises a common input port, a power supply and control signal port, a control module, a millimeter wave circuit module and a transmission output port which are in tile type laminated layout; the millimeter wave circuit module comprises a two-way power divider, an eight-way power divider and a four-way power divider integrated chip; the four-way power divider, a VM phase shifter and a power amplification circuit are integrated inside the four-way power divider integrated chip; a millimeter wave transmission signal is accessed from the common input port, and is divided intosixty-four paths of transmission signals through the two-way power divider, the eight-way power divider and the four-way power divider integrated chip; and the control module controls the VM phase shifter to perform amplitude phase adjustment on the millimeter wave transmission signal. The integrated millimeter wave tile type TR component provided by the invention can effectively improve the integration level of the TR component, has the advantages of being high in integration, low in profile, light in weight, and high in efficiency, and meets the application requirements of a new system equipment platform on a phased array antenna.

The invention discloses a dual polarization integration plane lens antenna. The antenna which is in a layered structure is sequentially provided with a plane lens, a secondary feed source and a dual polarization primary feed source; a metal antenna support is arranged on the exterior. According to the dual polarization integration plane lens antenna which is based on a plane substrate integration waveguide structure, a substrate integration waveguide cavity antenna serves as a dual polarization feed source to perform feed on the secondary feed source, the secondary feed source and the primary feed source form into an equivalent feed source to feed the plane lens commonly, phase compensation is obtained from the lens, spherical waves are converted to be plane waves, and accordingly the antenna with high gain, high efficiency and stable pointing direction is achieved. The antenna aiming at development requirements of plane integration and a minimized long-distance wireless communication system with high gain, allows dual polarization and is low in profile, easy to integrate with a millimeter wave circuit is achieved under the Q-LINKAN application background. The dual polarization integration plane lens antenna has the advantages of being simple in design, firm in structure, compact in size and being capable of being integrated with the plane circuit.

The invention provides a suspended microstrip antenna array for 60GHz millimeter wave communication and an antenna thereof. The antenna array comprises antenna units and a feed network. The antenna units are arranged in an upper and lower two-row mode; the number of the antenna elements is 2*(2n), and n is a positive integer; the feed network comprises impedance transformers, coplane duel-wires, coplane waveguides and power dividers connected with the coplane duel-wires and the coplane waveguides; each antenna element is connected with one impedance transformer; the impedance transformers of the uplink antenna elements of the antenna units and the impedance transformers of the downlink antenna elements are arranged oppositely; the coplane duel-wires are connected with the antenna units via the impedance transformers; one power divider is connected at the axial central position of each coplane duel-wire; and one end of the coplane duel-wire is connected with the power divider and the other end is provided with a feed port. The suspended microstrip antenna has the advantages that the bandwidth is wide, the radiation loss is small, and integration with a plane millimeter wave circuit is easy.

The invention discloses a plane balun with filter and power dividing characteristics. The plane balun comprises a substrate integrated waveguide, a substrate integrated waveguide inductive window and a metal sticker, the substrate integrated waveguide inductive window is positioned in the substrate integrated waveguide, the metal sticker comprises an upper surface metal sticker and a lower surface metal sticker, the upper surface metal sticker, an input end, a first output end and an upper slot line are arranged on the upper surface of a dielectric substrate, and the lower surface metal sticker, a second output end and a lower slot line are arranged on the lower surface of the dielectric substrate. Compared with the prior art, a substrate integrated waveguide filter, a substrate integrated waveguide power divider and a substrate integrated waveguide balun are organically integrated together to form a substrate integrated waveguide filter and power dividing balun with excellent frequency selection characteristics and energy distribution characteristics. The whole balun is implemented by the aid of a traditional PCB (printed circuit board) process, integration is facilitated in a microwave and millimeter wave circuit, and the balun is simple in structure and easy to design.

Circuits having active devices, a pattern for a circulator or isolator, and ferrite are formed on a semiconductor microwave-millimeter wave circuit substrate. The ferrite is embedded in a dielectric substrate. The dielectric substrate is oppositely aligned with the semiconductor microwave-millimeter wave circuit substrate having the pattern for the circulator or the like. Thus, the pattern is coupled with the ferrite so as to structure the circulator or isolator.

The invention discloses an ideal inverter based broadband unequal six-port balancing network. The ideal inverter based broadband unequal six-port balancing network comprises a microstrip line structure and two 180-degree ideal broadband inverter structures, wherein symmetrical left and right broadband power dividing networks and two half-wavelength transmission lines connected in parallel in the middle form the six-port balancing power dividing network. The two half-wavelength transmission lines connected in parallel in the middle can better inhibit common-mode signals, a half-wavelength microstrip branch line connected with a power dividing input port in parallel further increases the transmission zero, and the common-mode rejection bandwidth is broadened. The isolation of an output port is improved effectively by the aid of four isolation resistors connected in the middle of the inverters in parallel. By the aid of the whole balancing circuit, the common-mode rejection bandwidth is increased to be higher than 110%, the isolation of power dividing ports is larger than 30 dB, and the balancing network is compact in structure, simple in design and good in electrical property and is easily integrated with other planar microwave and millimeter wave circuits and systems.

According to an embodiment, a circuit board includes a signal line including at least portion of a first conductive layer that has a first portion extending over a cavity in the circuit board from a first side of the cavity. The circuit board also includes a first plurality of conductive vias surrounding the cavity and the first plurality of vias include at least one blind via disposed adjacent to the first side of the cavity.

The invention provides a method of protection treatment on a millimeter-wave circuit component by use of a vacuum vapor deposition membrane. Through the method, the corrosion resistance and long-term work reliability of the millimeter-wave circuit component can be obviously improved, the volume and weight can be greatly reduced, and the protection treatment method adopting metal shell leaktight encapsulation is not needed. The method comprises the following steps of: putting the millimeter-wave circuit component subjected to partial protection treatment into a vacuum oven for vacuum drying treatment under clean environment; placing the millimeter-wave circuit component on a tool rack of a room-temperature vacuum deposition chamber of a coating machine, and sealing and vacuumizing the chamber; heating p-xylene ring dimer at 175 DEG C to sublimate into a gaseous state, and feeding into a splitting cavity of the coating machine so that the molecular bond of the xylene ring dimer is broken at 680 DEG C and the xylene ring dimer is split into a p-xylene monomer with reactivity; and feeding the p-xylene monomer into the room-temperature vacuum deposition chamber so that the p-xylene monomer deposits on the surface of the millimeter-wave circuit component and is polymerized to form a parylene film protection layer.

The invention provides a micro assembly process for a millimeter-wave circuit. The process comprises the following steps: providing an RF board, a power board, a cavity seat, two pressure blocks and a cover plate; detecting the RF board and the power board, as well as a circuit cavity body and the two pressure blocks; engraving the RF board shape; carrying out trail assembly of the circuit cavity body, and then cleaning; installing the RF board and the power board, as well as related RF devices; testing a passive circuit; installing RF and power circuit devices; assembling MMIC (Monolithic Microwave Integrated Circuit) chip components; forming installation grooves of the MMIC chip components; installing the MMIC chip components in the grooves; bonding lead wires; installing and welding circuit devices and structural parts; debugging DC working points and the RF characteristics of the circuit; and cleaning the interior of the circuit. Due to the adoption of the process, the MMIC chip can be effectively installed and used, accordingly, the functions of the MMIC chip can played, so as to improve the success rate of manufacturing the microwave millimeter wave circuit and a subsystem through utilizing the MMIC chip; and in addition, the blank in millimeter-wave micro assembly technology is filled in China.

The invention relates to a millimeter wave array radiometer front end capable of realizing analog beamforming. The millimeter wave array radiometer front end comprises a radio frequency receiving circuit, a local oscillator driving phase shift circuit, an intermediate frequency combination gain adjustable circuit and a direct current power supply and digital control circuit. The radio frequency receiving circuit is arranged in an array mode and comprises eight mutually independent receiving channels, and signals are input through waveguide ports and transmitted to a millimeter wave circuit through waveguide micro-strip conversion to be amplified and mixed; a local oscillator driving signal is input through a port and is divided into eight paths in the module, and the local oscillator signal of each path passes through an analog phase shifter to realize 360-degree high-precision continuous adjustment of the phase; and intermediate frequency signals after down-conversion of each channelcan realize gain adjustment, and finally combined output is realized. The millimeter wave array radiometer front end with multiple channels, high integration level, high sensitivity, low cost and independently adjustable gain phase is realized, and the millimeter wave array radiometer front end has important practical significance for realizing real-time tracking, automatic zooming and rapid imaging of a pass-type millimeter wave human body security inspection instrument.

A phase shifter is one of key modules in microwave and millimeter wave circuit and system, and is widely applied to the aspects of phased array beam forming, orthogonal circuit design, instrument and equipment testing and the like. The invention proposes a substrate integrated waveguide (SIW) phase shifter loaded with rectangular air slots. The phase shifter comprises two typical SIW circuit structures of a branch circuit I and a branch circuit II. The branch circuit I corresponds to a referenced zero phase; and a plurality of rectangular air slots are formed in an SIW body in the circuit structure of the branch circuit II and correspond to required phase shifting degrees. The branch circuit II further comprises a one-side metalized dielectric PCB cover plate matched in size with the SIW body. Four metalized matching through holes are introduced in upper and lower parts of the edge, connected with the SIW body, of a gradual transition structure. The phase shifter realizes relatively wide frequency bandwidth and has relatively low insertion loss and fixed zero phase reference value; and the phase shifter can be conveniently integrated with other planar passive and active circuits, can be realized on a PCB and is relatively low in cost and convenient and reliable to machine.

The invention discloses a microwave/millimeter wave substrate integrated waveguide E-surface inductive band filter, comprising a dielectric substrate with double sides provided with metal chips, where the dielectric substrate is provided with an integrated waveguide, which is composed of at least two rows of metallic through holes, one surface of the dielectric substrate is provided with input and output ends respectively connected with two ends of the metal chips, an E-surface inductive band is arranged in the center of the integrated waveguide and of metallic through holes. And it is implemented by traditional PCB or LTC process, beneficial to its integration in the design of a microwave/millimeter wave circuit, simple in structure, and easy to design and low-cost, almost no parasitic radiation and having good frequency selectivity.

The substrate-integrated waveguide pseudo-inductive window filter for wavelet/millimeter wave circuit comprises: a metal paster (1) on the media substrate (2), which has rectangular middle and funnel-like ends; four couple of through holes (31) in middle rectangle of (1) arranged from the input end (4) to the output end (5) as four rows, wherein, four large holes on the middle rows. Compared with prior art, this invention is convenient to integrate and process with low cost.

The invention discloses a multiport high-isolation-degree balance power dividing network based on broadside coupling. The multiport high-isolation-degree balance power dividing network comprises an upper-layer structure and a lower-layer structure, wherein the upper-layer structure forms a six-port balance power distributing network through parallel connection of two-stage broadband Baluns, transmission of broadband different-mode signals is achieved through four pairs of short-circuited coupling lines, the isolation degree of different-mode signal power dividing can be effectively improved through two isolation resistors connected at the output ends of the Baluns in parallel, multiple open-circuited branch lines loaded on an upper-layer metal layer can produce multiple transmission zero points, the inhibition degree of common-mode signals is effectively improved, the coupling degree of the short-circuited coupling lines can be effectively improved through four metal sheets on the lower layer, and power dividing bandwidth of the coupling lines in the upper-layer metal layer is increased. The different-mode signal bandwidth in a balance circuit can be improved to be higher than 50% by means of a whole balance circuit structure, and the multiport high-isolation-degree balance power dividing network is simple in structural design, small in size and good in electrical performance and is easily integrated with other plane microwave millimeter wave circuits.