Plane balun with filter and power dividing characteristics
A characteristic and flat technology, applied in the field of substrate-integrated waveguide filtering power division baluns, can solve problems such as increased design cost, and achieve the effects of small size, light weight and simple structure
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[0020] The present invention is realized by PCB technology, and the manufacturing method and process are combined figure 1 and figure 2 to illustrate. The balun is composed of a metal patch 5, a dielectric substrate 6, and a metallized through hole 1, wherein the metal patch 5 includes an upper surface metal patch 51 and a lower surface metal patch 52, and the upper surface metal patch 51 is located on the dielectric substrate. On the upper surface of the sheet 6 , the upper surface metal patch 51 includes the input end 2 , the first output end 3 and the upper groove line 8 . The lower surface metal patch 52 includes the second output terminal 4 and the lower groove line 9 . The metal patch 51 on the upper surface and the metal patch 52 on the lower surface are connected by the metal through hole 1, and the metal through hole is punched through in actual processing, and the through hole can be metallized. The entire balun can be processed using a single-layer PCB board, a...
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