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Plane balun with filter and power dividing characteristics

A characteristic and flat technology, applied in the field of substrate-integrated waveguide filtering power division baluns, can solve problems such as increased design cost, and achieve the effects of small size, light weight and simple structure

Active Publication Date: 2014-07-23
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, the design cost of the system increases sharply

Method used

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  • Plane balun with filter and power dividing characteristics
  • Plane balun with filter and power dividing characteristics
  • Plane balun with filter and power dividing characteristics

Examples

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Embodiment Construction

[0020] The present invention is realized by PCB technology, and the manufacturing method and process are combined figure 1 and figure 2 to illustrate. The balun is composed of a metal patch 5, a dielectric substrate 6, and a metallized through hole 1, wherein the metal patch 5 includes an upper surface metal patch 51 and a lower surface metal patch 52, and the upper surface metal patch 51 is located on the dielectric substrate. On the upper surface of the sheet 6 , the upper surface metal patch 51 includes the input end 2 , the first output end 3 and the upper groove line 8 . The lower surface metal patch 52 includes the second output terminal 4 and the lower groove line 9 . The metal patch 51 on the upper surface and the metal patch 52 on the lower surface are connected by the metal through hole 1, and the metal through hole is punched through in actual processing, and the through hole can be metallized. The entire balun can be processed using a single-layer PCB board, a...

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PUM

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Abstract

The invention discloses a plane balun with filter and power dividing characteristics. The plane balun comprises a substrate integrated waveguide, a substrate integrated waveguide inductive window and a metal sticker, the substrate integrated waveguide inductive window is positioned in the substrate integrated waveguide, the metal sticker comprises an upper surface metal sticker and a lower surface metal sticker, the upper surface metal sticker, an input end, a first output end and an upper slot line are arranged on the upper surface of a dielectric substrate, and the lower surface metal sticker, a second output end and a lower slot line are arranged on the lower surface of the dielectric substrate. Compared with the prior art, a substrate integrated waveguide filter, a substrate integrated waveguide power divider and a substrate integrated waveguide balun are organically integrated together to form a substrate integrated waveguide filter and power dividing balun with excellent frequency selection characteristics and energy distribution characteristics. The whole balun is implemented by the aid of a traditional PCB (printed circuit board) process, integration is facilitated in a microwave and millimeter wave circuit, and the balun is simple in structure and easy to design.

Description

technical field [0001] The invention relates to a substrate integrated waveguide filter power divider balun which can be applied to the design of microwave and millimeter wave circuits and can also be used in the design of microwave and millimeter wave array antennas in highly integrated systems such as SOP and SOC. Background technique [0002] Baluns are key components in many microwave and millimeter wave systems. With the continuous development of today's communication technology, there is an urgent need for baluns with miniaturization, wide frequency band, easy integration and high performance. In the communication system, on the one hand, due to the nonlinear characteristics of active devices, high requirements are placed on the selectivity of the filter; on the other hand, for the feeding system of the array antenna, the power divider is required to have good energy distribution characteristic. The commonly used balun only has the functions of impedance transformatio...

Claims

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Application Information

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IPC IPC(8): H01P5/10
Inventor 郝张成丁文其霍新平
Owner SOUTHEAST UNIV
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