Method of protection treatment on millimeter-wave circuit component by use of vacuum vapor deposition membrane

Abstract

The invention provides a method of protection treatment on a millimeter-wave circuit component by use of a vacuum vapor deposition membrane. Through the method, the corrosion resistance and long-term work reliability of the millimeter-wave circuit component can be obviously improved, the volume and weight can be greatly reduced, and the protection treatment method adopting metal shell leaktight encapsulation is not needed. The method comprises the following steps of: putting the millimeter-wave circuit component subjected to partial protection treatment into a vacuum oven for vacuum drying treatment under clean environment; placing the millimeter-wave circuit component on a tool rack of a room-temperature vacuum deposition chamber of a coating machine, and sealing and vacuumizing the chamber; heating p-xylene ring dimer at 175 DEG C to sublimate into a gaseous state, and feeding into a splitting cavity of the coating machine so that the molecular bond of the xylene ring dimer is broken at 680 DEG C and the xylene ring dimer is split into a p-xylene monomer with reactivity; and feeding the p-xylene monomer into the room-temperature vacuum deposition chamber so that the p-xylene monomer deposits on the surface of the millimeter-wave circuit component and is polymerized to form a parylene film protection layer.

Description

technical field [0001] The invention relates to a protection method for millimeter wave circuit components. Background technique [0002] Modern electronic equipment is developing in the direction of short, small, light, thin, high reliability, high speed, high performance and low cost, especially airborne, ship-borne and space-borne electronic equipment, and portable electronic products have a large impact on volume and weight. The requirements for reliability and reliability are becoming more and more stringent. It is required to continuously increase the assembly and interconnection density of microwave circuits to achieve miniaturization, light weight and high reliability of microwave circuits. Higher requirements are put forward for microwave components and their micro-assembly technology. Therefore, multi-chip module technology has been widely researched and applied. [0003] Millimeter-wave circuit components with an operating frequency of around 35GHz include millim...

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to solve the problems of large volume and weight and long design and manufacturing cycle caused by the hermetic package protection of millimeter wave circuit components, and to provide a method that does not need to use metal shell hermetic package, which can improve the combination of lead wires and solder joints. Strength, to ensure the long-term normal operation of the bare chip, to maintain the high reliability of the circuit in the salt spray test and other harsh environments, and to improve the corrosion resistance of the millimeter wave circuit components and the long-term reliability of the vacuum vapor deposition film protection The processing method to solve the problem of complex design of hermetic packaging structure and high cost

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