Integrated millimeter wave tile type TR component

Abstract

The invention relates to the technical field of wireless communication equipment, and specifically relates to an integrated millimeter wave tile type TR component. The integrated millimeter wave tiletype TR component comprises a common input port, a power supply and control signal port, a control module, a millimeter wave circuit module and a transmission output port which are in tile type laminated layout; the millimeter wave circuit module comprises a two-way power divider, an eight-way power divider and a four-way power divider integrated chip; the four-way power divider, a VM phase shifter and a power amplification circuit are integrated inside the four-way power divider integrated chip; a millimeter wave transmission signal is accessed from the common input port, and is divided intosixty-four paths of transmission signals through the two-way power divider, the eight-way power divider and the four-way power divider integrated chip; and the control module controls the VM phase shifter to perform amplitude phase adjustment on the millimeter wave transmission signal. The integrated millimeter wave tile type TR component provided by the invention can effectively improve the integration level of the TR component, has the advantages of being high in integration, low in profile, light in weight, and high in efficiency, and meets the application requirements of a new system equipment platform on a phased array antenna.

Description

technical field [0001] The invention relates to the technical field of wireless communication equipment, in particular to an integrated millimeter-wave tile-type TR assembly. Background technique [0002] With the development of millimeter-wave phased array antenna technology, its application in communication and data transmission and other system equipment is gradually popularized. Its flexible and convenient electronic beam scanning system replaces the traditional fixed beam antenna combined with mechanical scanning system, which meets high requirements. Speed, high precision, and high reliability application requirements. However, the integration, complexity, and diversification of the platform carrier and its application scenarios and environments have put forward new stringent requirements for the function, performance, and platform adaptability of the loaded phased array antenna, such as low profile, miniaturization, Lightweight, low power consumption, etc. Due to th...

AI Technical Summary

Problems solved by technology

As the core component of the phased array antenna, if the existing mature brick-type integration method is adopted to realize the circuit layout vertically along the transmission direction of the signal, and the horizontal assembly is assembled into an array, sufficient vertical space will be required to carry out the sub-component layout , connection, thereby introducing a larger thickness dimension, making the phased array antenna larger; at the same time, the assembly form of the longitudinal layout makes the engineering realization of the TR component very dependent on the metal cavity and the peripheral structure, and introduces a larger weight; in addition, The vertical layout form along the signal transmission direction makes the components in the module have a single function and scattered layout. Although it is beneficial to performance stability design and wiring design, the integration level is low and the number of components used is large, which is not conducive to low cost, mass production

Therefore, the existing brick-type TR components have defects such as large vertical size, heavy weight, low integration, low efficiency, and high cost, making them unable to meet the application requirements of the new generation of system equipment platforms for phased array antennas.

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