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heat sink

A technology of heat dissipation device and heat dissipation fins, applied in cooling/ventilation/heating transformation, instruments, electrical digital data processing, etc., can solve problems such as affecting heat conduction, affecting connection stability, affecting the smoothness of the bottom end of the heat sink, etc. , to ensure the stability of the connection, easy assembly, and improve the effect of heat dissipation

Inactive Publication Date: 2011-12-28
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the fastening mechanism of this heat sink is located at the bottom of the heat sink and is in the shape of a notch. This structure will affect the smoothness of the bottom of the heat sink, and then cause adverse effects on the connection between the heat sink and the substrate, not only affecting the connection Stability, which also affects the conduction of heat

Method used

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Embodiment Construction

[0012] see Figure 1 to Figure 4 , The heat dissipation device of the present invention includes a heat sink 10 , two heat pipes 70 , a heat dissipation fan 90 and two fan fixing parts 80 .

[0013] The heat sink 10 includes a bottom plate 12 and a heat dissipation fin set 14 , and the heat dissipation fin set 14 is disposed above the bottom plate 12 . The heat dissipation fin group 14 is formed by interlocking a plurality of heat dissipation fins 140, two semicircular grooves 146 are formed below the heat dissipation fin group 14, and the two grooves 146 on the corresponding heat dissipation fin group 14 are provided on the bottom plate 12. There are two semicircular receiving grooves 122 , and the two grooves 146 and the two receiving grooves 122 are combined to form two circular grooves on the contact surface between the cooling fin set 14 and the bottom plate 12 . Each heat pipe 70 includes a condensing section and an evaporating section, the condensing section is passed ...

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PUM

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Abstract

A heat dissipation device, comprising a plurality of heat dissipation fins interlocked, each heat dissipation fin includes a body and at least one buckle set on the body facing the adjacent heat dissipation fins, the buckle includes an arch connected to the body Shape joint part and an arc-shaped buckle part located at the free end of the buckle piece, the joint part on each heat dissipation fin is accommodated in the buckle part on the adjacent heat dissipation fin so that the buckle part and the joint part are overlapped so that all The radiating fins are connected together, the buckle is located in the middle of the body, the body forms a square hole corresponding to the buckle, the buckle is located on one side of the square hole, the body is a flat plate, and a vertical hole is formed in the center of the body. There are multiple straight slots, which are distributed on the body on both sides of the slot, and the plurality of buckles extend obliquely toward the direction of the slot from top to bottom.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device for cooling electronic components. Background technique [0002] With the rapid development of the computer industry, more and more heat is generated by heat-generating electronic components such as micro-processing chips. Electronic components dissipate heat. [0003] A traditional heat sink includes a base plate and a plurality of heat dissipation fins mounted on the base plate. These heat dissipation fins are L-shaped. When the heat sink is subjected to a lateral impact force, the heat dissipation fins are easily deformed due to extrusion. In order to overcome the above problems, heat sinks with interlocking structures have appeared in the industry. The top and bottom ends of this heat sink are respectively provided with a buckle mechanism. The fastening mechanisms of the adjacent heat sinks cooperate to achieve the interlocking effect between the heat s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/367H01L23/40H01L23/427G06F1/20H05K7/20
Inventor 查新祥郭哲豪
Owner FU ZHUN PRECISION IND SHENZHEN