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LED encapsulating array, structure and method

A technology for light-emitting diodes and packaging methods, applied in electrical components, electrical solid-state devices, circuits, etc., can solve problems such as product yield decline, uneven coating of coating layers, and inconsistency with automated production trends, to improve productivity and Yield effect

Inactive Publication Date: 2011-01-26
I CHIUN PRECISION ELECTRIC IND CHINA
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  • Abstract
  • Description
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Problems solved by technology

[0006] 2. Apply a layer of black pigment on the surface of the rubber base by manual ink brushing as a coating layer; however, this method of manually brushing ink on the surface of the rubber base to form a coating layer not only does not In line with the current industrial automation production trend, it is easier to cause uneven coating of the coating layer due to human factors and reduce product yield

Method used

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  • LED encapsulating array, structure and method
  • LED encapsulating array, structure and method
  • LED encapsulating array, structure and method

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Embodiment Construction

[0047] The implementation of the present invention will be described in detail below with reference to the drawings and examples, so as to fully understand and implement the implementation process of how to use technical means to solve technical problems and achieve technical effects in the present invention.

[0048] FIG. 1 is a schematic top view of the rubber seat and pin unit of the present invention in the first embodiment. Please refer to FIG. 1 , the steps of the light emitting diode packaging method of the present invention include firstly forming a plurality of glue bases 110 and a plurality of lead units 120 . In this embodiment, for example, a plurality of pin units 120 arranged in an array are formed on a metal plate 101 through stamping and electroplating processes, and each pin unit 120 includes At least one pair of pins 122a and 122b.

[0049] Then, a plurality of plastic seats 110 arranged in an array are formed by insert molding, so that the pins 122a and 122...

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Abstract

An LED encapsulating array, an encapsulating structure and an encapsulating method are disclosed in the invention, which produce light absorbing sheets in a way of automatic mass production and combine the light absorbing sheets on a rubber seat surface to absorb the ray radiated to the rubber seat surface; therefore, compared with the way of forming a coating by manually brushing ink on the rubber seat surface in the prior art, the invention can effectively reduce the manufacture process time required by LED encapsulating structure, can avoid the occurrence of the problem of poor ink brushing quality caused by human factors in the process of manual ink brushing, thus effectively improving the productivity and defect-free rate of the LED encapsulating structure.

Description

technical field [0001] The present invention relates to a light emitting diode packaging array, packaging structure and packaging method, and particularly relates to a light emitting diode packaging array, packaging structure and packaging method capable of forming a light absorbing sheet on the surface of the glue seat. Background technique [0002] In recent years, light-emitting diodes (Light Emitting Diodes, LEDs) have the advantages of low power consumption, long component life, no need for warm-up time, and fast response speed. In addition, they are small in size, resistant to vibration, suitable for mass production, and easy to cooperate with applications. Therefore, light-emitting diodes have been widely used in indicator lights and display devices of information, communication and consumer electronics products, such as mobile phones and personal digital assistants (Personal Digital Assistant, PDA) screens Backlight, various outdoor displays, traffic lights and light...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/00H01L25/075H01L21/50H01L33/00
CPCH01L24/97H01L2224/48091H01L2224/48247
Inventor 朱新昌李廷玺
Owner I CHIUN PRECISION ELECTRIC IND CHINA
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