Substrate panel

Abstract

The invention relates to a substrate panel, which mainly comprises two or more than two substrate strips arranged on the substrate panel in an array, two or more than two electroplating buses, two or more than two electroplating string connection wires connected between the substrate strips and connected with two adjacent substrate strips, and a current input gate port buffer area. The electroplating buses connect lateral margins of the substrate panel to the adjacent substrate strips; and the current input gate port buffer area is arranged at a non-substrate strip part of the substrate panel and provided with a current buffer frame and two or more than two net wires, wherein the current buffer frame is in cross connection with the electroplating buses, the net wires are in cross connection with the electroplating string connection wires, and two ends of the net wires are connected to the current buffer frame. Therefore, the current is evenly dispersed to each substrate strip during electroplating, the problem of inconsistent thickness of an electroplating layer due to unevenness of the current density is improved, and instantaneous high current can be buffered and instable voltage can be relaxed to protect internal circuits of the substrate strips.

Description

technical field [0001] The invention relates to a printed circuit board, especially a substrate panel. Background technique [0002] At present, the printed circuit board can be used as a micro-substrate (or referred to as a substrate unit) for carrying chips, and a plurality of micro-substrates arranged in an array are formed in a substrate strip (Substrate Strip). Semiconductor packaging / assembly operations are carried out by substrate strip transfer. In addition, a plurality of substrate strips arranged in an array form a substrate panel (Substrate Panel), so as to facilitate mass production using a printed circuit board process. Usually, before these substrate strips are singulated and separated, the substrate panel will be subjected to an electroplating step in order to plate nickel / gold or other electroplating layers on these substrate strips to prevent oxidation of exposed metal pads and facilitate metal bonding in subsequent processes , such as putting gold wires o...

AI Technical Summary

Problems solved by technology

And because the conduction direction of the current is from the current input side edge 101 to the current output side edge 102, so that the current density passing through the substrate strips 110 will gradually decrease as the distance from the current input side edge 101, so the same substrate panel is formed. Depending on the position of the substrate strip 110 within 100, there will be problems of different plating thickness and plating roughness, thus resulting in poor plating quality

Even in semiconductor packaging / assembly operations, there may be problems with wire bonding failures or poor soldering

In addition, when electroplating, large instantaneous current or unstable voltage will cause damage to the internal circuits of the connected substrate strips 110A via the electroplating buses 121

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