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Nano-diamond thermal grease

A technology of nano-diamond and nano-diamond powder, which is applied in the direction of heat exchange materials, chemical instruments and methods, and can solve the problems of affecting the thermal conductivity of heat dissipation paste, poor thermal conductivity of heat dissipation paste, and poor thermal conductivity.

Active Publication Date: 2011-07-20
KUNSHAN NANO NEW MATERIAL TECH
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

However, commercially available thermal paste contains a large amount of binders with poor thermal conductivity, resulting in poor thermal conductivity of the overall thermal paste, and many thermal pastes using nano-scale high thermal conductivity materials tend to reduce the surface area of ​​the nano-sized powder in the matrix. Due to its stability, it is easy to agglomerate into large-diameter particles, resulting in poor effect of filling the gap between electronic components and thermal pads, thus affecting the thermal conductivity of thermal paste

Method used

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Embodiment Construction

[0031] The invention provides a nano-diamond heat dissipation paste. The nano-diamond heat dissipation paste comprises nano-diamond powder, high thermal conductivity powder and a matrix. The volume percentage of the nano-diamond powder is 5-30%, the volume percentage of the high thermal conductivity powder is 40-90%, and the volume percentage of the matrix is ​​5-30%. Among them, the nano-diamond powder and the high thermal conductivity powder are evenly dispersed in the matrix to become a nano-diamond thermal paste with high thermal conductivity.

[0032] The high thermal conductivity powder may include a first high thermal conductivity powder with a larger particle diameter and a second high thermal conductivity powder with a smaller particle diameter. The first high thermal conductivity powder can be a powder with a diameter of 15-50 microns, the second high thermal conductivity powder can be a powder with a diameter of 1-10 microns, and the first high thermal conductivity ...

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Abstract

The invention discloses a nano-diamond thermal grease, which comprises the following components in percentage by volume: 5 to 30 percent of nano-diamond powder, 40 to 90 percent of high-thermal conductivity powder and 5 to 30 percent of substrate. The nano-diamond powder and the high-thermal conductivity powder are uniformly dispersed into the substrate, thereby forming the nano-diamond thermal grease of high-thermal conductivity.

Description

technical field [0001] The invention relates to a nano-diamond heat dissipation paste, in particular to a nano-diamond heat dissipation paste that utilizes the high thermal conductivity of the nano-diamond to rapidly conduct high heat generated during the operation of an electronic component to a heat-conducting sheet to maintain the performance of the electronic component. Background technique [0002] At present, miniaturization has become the most important issue in the development of integrated circuits. The size of various electronic components is getting smaller and faster, and the operating speed is getting faster and faster. How to quickly remove the high heat generated by electronic components during operation to maintain their working performance And stability has also become one of the focuses of research. [0003] In order to effectively dissipate the high heat generated during the operation of electronic components, it is a common practice in the industry to coa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09K5/08
Inventor 吕鸿图优维罗夫・席格
Owner KUNSHAN NANO NEW MATERIAL TECH
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