Nano-diamond thermal grease

Abstract

The invention discloses a nano-diamond thermal grease, which comprises the following components in percentage by volume: 5 to 30 percent of nano-diamond powder, 40 to 90 percent of high-thermal conductivity powder and 5 to 30 percent of substrate. The nano-diamond powder and the high-thermal conductivity powder are uniformly dispersed into the substrate, thereby forming the nano-diamond thermal grease of high-thermal conductivity.

Description

technical field [0001] The invention relates to a nano-diamond heat dissipation paste, in particular to a nano-diamond heat dissipation paste that utilizes the high thermal conductivity of the nano-diamond to rapidly conduct high heat generated during the operation of an electronic component to a heat-conducting sheet to maintain the performance of the electronic component. Background technique [0002] At present, miniaturization has become the most important issue in the development of integrated circuits. The size of various electronic components is getting smaller and faster, and the operating speed is getting faster and faster. How to quickly remove the high heat generated by electronic components during operation to maintain their working performance And stability has also become one of the focuses of research. [0003] In order to effectively dissipate the high heat generated during the operation of electronic components, it is a common practice in the industry to coa...

AI Technical Summary

Problems solved by technology

However, commercially available thermal paste contains a large amount of binders with poor thermal conductivity, resulting in poor thermal conductivity of the overall thermal paste, and many thermal pastes using nano-scale high thermal conductivity materials tend to reduce the surface area of ​​the nano-sized powder in the matrix. Due to its stability, it is easy to agglomerate into large-diameter particles, resulting in poor effect of filling the gap between electronic components and thermal pads, thus affecting the thermal conductivity of thermal paste

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