Method for exposing single-sided flexible circuit board

Abstract

The invention discloses a method for exposing a single-sided flexible circuit board, which comprises the following steps: fixing a first film with the film surface facing upwards on a platform surface of an exposure machine; placing a second film with the film surface facing downwards on the first film and aligning the two films; buckling down a mylar film of the exposure machine for the convenience of fixing the second film on the mylar film, and then pulling up the mylar film; contacting a first flexible circuit board and a substrate of a second flexible circuit board, aligning and stacking the first flexible circuit board and the substrate together, and then placing the two on the first film and aligning; and buckling down the mylar film to expose the dry films of the first flexible circuit board and the second flexible circuit board at the same time. The method for exposure production operations improves the exposure production efficiency of the device and promotes the exposure productivity of the exposure machine, and simultaneously the implementation mode is simple without cost input and the consumption of additional charges.

Description

technical field [0001] The invention relates to the field of circuit board manufacturing, in particular to an exposure method for a flexible circuit board. Background technique [0002] In the field of flexible printed circuit (FPC) (Flexible Printed Circuit), with the increasingly fierce competition, the reduction of cost and the improvement of production efficiency have become more and more important. How to shorten the production cycle, improve production efficiency, increase equipment utilization, and reduce cost input has become an issue worth considering more and more. At present, in the production process of FPC, especially in the exposure process of single-sided FPC, the main problems are low production efficiency and serious waste of equipment production capacity. [0003] figure 1 A conventional single-sided FPC structure is shown. 1 shown in the figure is a laminated single-sided FPC, which has three parts: dry film layer 2, copper foil layer 3, and substrate l...

AI Technical Summary

Problems solved by technology

[0008] This kind of production method has the following disadvantages, which determines that it cannot be promoted on a large scale:

[0009] 1. Each exposure table needs to be increased by one person, and one exposure machine needs to add 2 people for 2 tables;

[0010] 2. Since the single-sided FPC product is very thin, generally around 50 microns, manual lamination, tape fixing and tape removal can easily lead to product wrinkles, thereby affecting product yield;

[0011] 3. Since there is no fixing measure between the first FPC and the first film, slight sliding and translation during the placement of the second PFC will cause the first FPC and the first film to be misaligned, resulting in alignment deviation;

[0012] 4. The second film will be contaminated with foreign matter during the repeated bonding process, and will pollute the glass table of the exposure machine, resulting in an increase in the defect rate of the FPC product line

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