Improved semiconductor water cooling module for computer display card

A semiconductor and computer technology, which is applied in the field of semiconductor water cooling modules for computer graphics cards, and can solve problems such as unsuitable application occasions and small application scope.

Inactive Publication Date: 2010-02-10
WUXI FORMEN TECHN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The current cooling of computer graphics cards generally adopts two methods of air cooling and water cooling. With the continuous development of graphics card processing chips, the heat generated during the work process continues to increase. In order to ensure good heat dissipation performance and normal operation of the graphics card, Its air cooling must be cooled by a high-

Method used

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  • Improved semiconductor water cooling module for computer display card
  • Improved semiconductor water cooling module for computer display card

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Embodiment Construction

[0009] See figure 1 , figure 2 , which includes a connecting piece, a copper plate 2, a graphics card, and a graphics card chip. The connecting piece is specifically a lower inlay block 1, which is connected to a graphics card, and a red copper plate 2 is installed on the non-graphics card contact surface side of the hollow in the middle of the lower inlay block 1. One side of the copper plate 2 protrudes from the hollow part of the lower insert to contact the graphics card chip, and the other side of the copper plate 2 is mounted on the cooling surface of the semiconductor cooling plate 5, and the hot surface of the semiconductor cooling plate 5 is in plane contact with the exchanger 7. The exchanger 7 is equipped with an external pipeline connection 11 . The protruding part of one side of the copper plate 2 is coated with thermally conductive adhesive 10, and the other side of the thermally conductive adhesive 10 is in plane contact with the graphics card chip. The copper ...

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Abstract

The invention relates to a semiconductor water cooling module for a computer display card, which can lower the temperature of a heating device to the temperature lower than ambient temperature, be suitable for various environmental occasions and achieve large application range and silence. The semiconductor water cooling module for a computer display card comprises a connecting element, a red copper plate, a display card and a display card chip and is characterized in that the connecting element is a lower embedding block; the lower embedding block is connected with the display card; one sideof a non-display card contact surface in the middle hollow position of the lower embedding block is provided with the red copper plate; one side of the red copper plate is in contact with the displaycard chip after protruding out of the hollow part of the lower embedding block, and the other side of the red copper plate is attached to the refrigerating surface of a semiconductor refrigerating sheet; the hot surface of the semiconductor refrigerating sheet is in contact with the plane of an exchanger, and the exchanger is provided with an external pipeline interface.

Description

(1) Technical field [0001] The invention relates to the technical field of cooling of computer graphics cards, in particular to a semiconductor water cooling module for computer graphics cards. (2) Background technology [0002] The current cooling of computer graphics cards generally adopts two methods of air cooling and water cooling. With the continuous development of graphics card processing chips, the heat generated during the work process continues to increase. In order to ensure good heat dissipation performance and normal operation of the graphics card, Its air cooling must be cooled by a high-speed fan, which brings loud noise and vibration, which is annoying. However, in the existing water-cooling mode, the cooling effect of the water-cooling module can only reduce the temperature to the ambient temperature at most, which is not suitable for applications where the ambient temperature is relatively high (especially in summer), so its applicable range is small. (3)...

Claims

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Application Information

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IPC IPC(8): G06F1/20
Inventor 谈士权龚新林
Owner WUXI FORMEN TECHN
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