Circuit compensation system of circuit board and method for circuit compensation thereby
A circuit board circuit, compensation system technology, applied in the direction of secondary processing of printed circuits, etc., can solve the problems of broken wire size of conductive lines, scrapped circuit boards, affecting the transmission signals of circuit boards, etc., to improve production efficiency and simple operation. Effect
Active Publication Date: 2010-02-10
LEADING INTERCONNECT SEMICON TECH SHENZHEN CO LTD +2
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Problems solved by technology
[0004] However, the conductive circuit made by this method will inevitably have a broken line or a certain size of the circuit is smaller than the preset size, which will affect the signal transmission of the circuit board and cause the circuit board to be scrapped
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[0012] The circuit board line compensation system provided by the technical solution and the method for making a circuit board using the line compensation system will be described in detail below with reference to the embodiments and drawings.
[0013] see figure 1 , The circuit board circuit compensation system 100 provided by the embodiment of the technical solution includes an imaging device 10 , a control device 20 and a compensation device 30 . Wherein, the control device 20 is connected to the imaging device 10 and the compensation device 30 respectively.
[0014] The imaging device 10 is used to image the conductive circuit of the circuit board and visually display whether the circuit needs to be compensated, that is, to visually display whether there is a broken line in the circuit or whether the circuit size is smaller than a preset size, and transmit the circuit image to the control device 20 . The imaging device 10 can be a commonly used charge-coupled image senso...
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The invention relates to a circuit compensation system of a circuit board and a method for circuit compensation thereby. The compensation system comprises an imaging device, a control device and a compensation device, wherein the imaging device is used for circuit imaging of the circuit board and transmitting a circuit image to the control device; the control device comprises a storage module, a data processing module and a control module, wherein the storage module is connected with the data processing module and used for storing preset size data and preset position coordinate data of a circuit and transmitting the data to the data processing module; the data processing module is also connected with the imaging device and used for converting the circuit image into the actual size and theactual position coordinates of the circuit, analyzing whether the actual size and the actual position are accordant with the preset size and the preset position or not and transmitting an analysis result to the control module. The compensation device is used for filling conducing materials at the position of the circuit, which needs compositing, according to instructions of the control module tillthe size and the position of the circuit are accordant with the preset size and the preset position of the circuit.
Description
technical field [0001] The invention relates to the field of circuit board production, in particular to a circuit board line compensation system and a method for using the compensation system to compensate lines. Background technique [0002] Circuit boards are usually made of copper-clad substrates through processes such as lamination, exposure, development, etching, and gold plating. See literature: Traut, G.R; Rogers Corp., CT; Manufacturing and integration techniques of microwave circuits; IEEE colloquium on, Page 4 / 1~4 / 4; published on 10th Oct, 1988. [0003] The conductive circuit of the circuit board is usually made by the image transfer method. Specifically, the image transfer method includes the following steps: the first step is to lay a dry film on the surface of the conductive layer of the copper-clad substrate. In the second step, the dry film is exposed using a photomask, the photomask has openings, and the pattern of the openings is the same as the pattern o...
Claims
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IPC IPC(8): H05K3/22
Inventor 蔡崇仁张宏毅徐盟杰李文钦
Owner LEADING INTERCONNECT SEMICON TECH SHENZHEN CO LTD