Semiconductor substrate for solar cell and method for manufacturing same

Abstract

The present invention discloses a semiconductor substrate for a solar cell and a method for manufacturing the same. The semiconductor substrate of the present invention comprises a substrate and a surface passivation layer. The substrate has an upper surface. The surface passivation layer is formed on the upper surface of the substrate by an atom layer depositing process and / or a plasma-aided atom depositing process.

Description

technical field [0001] The invention relates to a semiconductor substrate, in particular to a semiconductor substrate for solar cells. Background technique [0002] Solar cells have been widely used because they convert energy from a light source (eg, sunlight) into electricity to power electronic devices such as computers, computers, heaters, and the like. [0003] So far, although silicon solar cells are the mainstream in the market, the problem of shortage of silicon source materials is becoming more and more serious. Therefore, in order to save materials and costs, the development of thin solar cells (for example, solar cells using thin silicon wafers as substrates) has become a trend. At the same time, in response to the development of thin solar cells, thin silicon wafers have been manufactured and applied to solar cells. [0004] The principle of solar cells is that photons enter the silicon substrate and are absorbed by the silicon substrate to transfer the energy ...

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Problems solved by technology

However, the thin silicon wafer 14 will be warped due to excessive temperature during the thermal oxidation process, which is not conducive to the subsequent process.

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